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进料检验程序In-ComingComponentInspectionProcedureI.贴片电阻SMDResistor抽样标准:GB2828计数抽样标准一般检查水平II,外观AQL=0.65,性能0.25SampleStandard:GB2828Samplelevel:II,VisualinspectionAQL=0.65,Capabilitytesting:0.251タト观检验Visualinspection1.1检测设备Equipmentused:放大镜Fteadingglass1.2检测方法及要求！estingmethodanddemand:1.2.1元件包装标识必须与实际产品・致Thekite-markonpackagethatmustbeaccordingwiththeproduction1.2.2用50倍放大镜检查电阻表面,不得有任何损坏及氧化现象CheckingthesurfaceoftheSMDresistorwith50multiplereadingglass,itmustnothaveanydamageandoxidationonsurface.1.2.3元件表面印字标识应正确,清晰可见.用酒精棉擦拭表面后,不得有损伤,标识仍应清晰可见.Thekite-markmustbecorrectandclearonthesurface.Thekite-markmustbeclearaftersurfacecleaningwithalky.2外形尺寸Figuresizes检测设备&|uipmentused:数显游标卡尺Verniercaliper检测方法及要求Testingmethodanddemand:根据厂商提供的规格说明书对元件尺寸进行测量,所测值不得超过规格书中规定的误差范围.Measuringthesizesaccordingasthespecificationwhichofferiedbythemanufacturer,themeasurementsmustbeintherangeonthespecification.3性能检验Capabilitytesting3.1阻值Ftesistancevalue3.1.1检测设备Equipmentused:LCR数字电标LCRbridgetester3.1.2检测方法及要求Testingmethodanddemand:将LCR数字电桥设置在测试电阻状态,测量电阻值,所测值不得超过电阻标识误差范围.Setupdigitalelectricbridgeintestingresistor,testingtheresistorwithLCRdigitalelectricbridge,themeasurementsmustbeintherangewhichmarkonthesurfaceoftheresistor.3.2可焊性Solderingtesting表面贴装可焊性,需参见国标检验方法(暂无此检验方法)ThesolderingtestingmethodofSMDpartsthatneedreferencestandardofChina.(Don'thavethestandardonhandatthemoment)

1I.贴片电容SMDCapacitor抽样标准:GB2828计数抽样标准一般检查水平II,外观AQL=0.65,性能0.25SampleStandard:GB2828Samplelevel:II,VisualinspectionAQL=0.65,Capabilitytesting:0.251.外观检验Visualinspection1.1检测设备Equipmentused:放大镜Fteadingglass检测方法及要求!estingmethodanddemand:1.1.1元件包装标识必须与实际产品・致Thekite-markonpackagethatmustbeaccordingwiththeproduction1.1.2用50倍放大镜检查电阻表面,不得有任何损坏及氧化现象CheckingthesurfaceoftheSMDcapacitorwith50multiplereadingglass,itmustnothaveanydamageandoxidationonsurface2.外形尺寸Figuresizes:1.1检测设备Equipmentused:数显游标卡尺Verniercaliper1.2检测方法及要求Testingmethodanddemand:根据厂商提供的规格说明书对元件尺寸进行测量,所测值不得超过规格书中规定的误差范围.Measuringthesizesaccordingasthespecificationwhichofferiedbythemanufacturer,themeasurementsmustbeintherangeonthespecification.3.性能检验Capabilitytesting3.1容量Capacity3.1.1检测设备Equipmentused:LCR数字电标LCRdigitalelectricbridge3.1.2检测方法及要求Testingmethodanddemand:将LCR数字电桥设置在测试电容状态,测量容量,所测值不得超过厂商提供的规格说明书中的误差范围.SetupLCRdigitalelectricbridgeintestingcapability,testingthecapabilitywithLCRdigitalelectricbridge,themeasurementsmustbeintherangeonthespecificationofmanufacturer.3.2散逸因素DF-Dissipationfactor3.2.1检测设备Equipmentused:LCR数字电桥LCRdigitalelectricbridge3.2.2检测方法及要求Testingmethodanddemand:根据厂商提供的规格说明书，设置测试条件,用LCR数字电桥测量DF值,所测值应符合规格说明书中的要求.Setupthetestingconditionaccordingasthespecificationofmanufacturer,testingtheDFwithLCRdigitalelectricbridge,themeasurementsmustbeaccordingwiththerequestinthespecification.3.3绝缘电阻!nsulationresistance3.3.1检测设备Equipmentused:

2绝缘电阻测量仪Insulationresistancetester3.1.1检测方法及要求Testingmethodanddemand:

3按厂商提供的规格说明书中设置测试电压及通电时间,用绝缘电阻测量仪测量绝缘电阻,所测结果必须符合规格说明书中的要求.Setupthetestingvoltageandtestingtimeaccordingasthespecificationofmanufacturer,thentesttheinsulationresistancewithinsulationresistancetester,themeasurementsmustbeaccordingwiththerequestinthespecification

4III.电阻DipResistor1.外观检验Visualinspection1.1检测设备Equipmentused:N/A1.2检测方法及要录Testingmethodanddemand:1.2.1元件包装标识必须与实际产品一致Thekite-markonpackagethatmustbeaccordingwiththeproduction.元件表面色标必须正确并清晰可见Thecolorringmustbecorrectandclearonthecomponentsurface.2.外形尺寸Rguresizes2.1检测设备Equipmentused:数显游标卡尺Verniercaliper2.2检测方法及要求!estingmethodanddemand:2.2.1根据厂商提供的规格说明书对元件尺寸进行测量,所测值不得超过规格书中规定的误差范围.Measuringthesizesaccordingasthespecificationwhichofferiedbythemanufacturer,themeasurementsmustbeintherangeonthespecification.将样品在PCB上试装,电阻脚应能正常插入。InstallingtheresistoronthePCB,thefeetshouldinsertintothePCBholesnormally.3性能检验Capabilitytesting3.1阻值Ftesistancevalue3.1.1检测设备日（uipmentused:LCR数字电库LCRdigitalelectricbridge3.1.2检测方法及要求Testingmethodanddemand:将LCR数字电桥设置在测试电阻状态,测量电阻值,所测值不得超过电阻标识误差范围.SetupLCRdigitalelectricbridgeintestingresistor,testingtheresistorwithLCRdigitalelectricbridge,themeasurementsmustbeintherangewhichmarkonthesurfaceoftheresistor.3.2可焊性Solderingtesting3.2.1检测设备Equipmentused:锡槽Tinpot,放大镜Readingglass3.2.2检测方法及耍求Testingmethodanddemand:将电容器的引脚以纵轴方向浸渍到235±5C的焊槽中,保持2±0.5sec取出,电容器的引脚经过浸渍过,表面必须覆盖有一层光滑明亮的焊锡,引脚表面只充许有少量分散的针孔或未上锡的缺陷,且这些缺陷不得集中在同一•区域.PuttingthefeetofcapacitorintotheTinpotat235±5℃,keep2±0.5sec,checkingthefeetwithreadingglass,thefeetsurfaceshouldbecoverbyabedoflubricityandbrightsolderingtin,thefeetsurfaceallowtohavealittlepinholeanddonothavetindispersedly.

5IV,薄膜,瓷片电容PolyesterfilmCapacitor&ceramicdisccapacitor

61.外观检验Visualinspection1.1检测设备Equipmentused:N/A1.2检测方法及要奈Testingmethodanddemand:1.2.1元件包装标识必须与实际产品一致Thekite-markonpackagethatmustbeaccordingwiththeproduction1.2.2元件表面印字标识应正确,清晰可见.用酒精棉擦拭表面后,不得有损伤,标识仍应清晰可见.Thekite-markmustbecorrectandclearonthesurface.Thekite-markmustbeclearaftersurfacecleaningwithalky2.外形尺寸Figuresizes:1.1检测设备日!uipmentused:数显游标卡尺Verniercaliper1.2检测方法及要求Testingmethodanddemand:根据厂商提供的规格说明书对元件尺寸进行测量,所测值不得超过规格书中规定的误差范围.Measuringthesizesaccordingasthespecificationwhichofferiedbythemanufacturer,themeasurementsmustbeintherangeonthespecification.3.性能检验Capabilitytesting3.1容量Capacity3.1.1检测设备Equipmentused:LCR数字电保LCRdigitalelectricbridge3.1.2检测方法及要求！estingmethodanddemand:将LCR数字电桥设置在测试电容状态,测量容量,所测值不得超过厂商提供的规格说明书中的误差范围.SetupLCRdigitalelectricbridgeintestingcapability,testingthecapabilitywithLCRdigitalelectricbridge,themeasurementsmustbeintherangeonthespecificationofmanufacturer.3.2散逸因素DF-Dissipationfactor3.2.1检测设备Equipmentused:LCR数字电桥LCRdig让alelectricbridge3.2.2检测方法及要求Testingmethodanddemand:根据厂商提供的规格说明书,设置测试条件,用LCR数字电桥测量DF值,所测值应符合规格说明书中的要求.Setupthetestingconditionaccordingasthespecificationofmanufacturer,testingtheDFwithLCRdigitalelectricbridge,themeasurementsmustbeaccordingwiththerequestinthespecification.3.3绝缘电阻!nsulationresistance3.3.1检测设备fe|uipmentused:绝缘电阻测量仪Insulationresistancetester3.3.2检测方法及要求Testingmethodanddemand:按厂商提供的规格说明书中设置测试电压及通电时间，用绝缘电阻测量仪测量绝缘电阻，所测结果必须符合规格说明书中的要求.Setupthetestingvoltageandtestingtimeaccordingasthespecificationofmanufacturer,then

7testtheinsulationresistancewithinsulationresistancetester,themeasurementsmustbeaccordingwiththerequestinthespecification3.1高压测试Hi-pottesting3.3.1测试设备Equipmentused:耐压测试仪Hi-pottester3.3.2测试方法及要求:设置测试电压1.5VR,测试1分钟,电容不得击穿.测量电容量,不得有变化.Setupthetestingvoltage:1.5Vr,testing1minutes,thecapacitormustnotbepunctured.Testingthecapacitance,itshouldnothaveanychange.3.5可焊性Solderingtesting3.5.1检测设备Equipmentused:锡槽Tinpot,放大镜Fteadingglass3.5.2检测方法及耍求Testingmethodanddemand:将电容器的引脚以纵轴方向浸渍到235±5C的焊槽中,保持2±0.5sec取出,电容器的引脚经过浸渍过,表面必须覆盖有一层光滑明亮的焊锡,引脚表面只充许有少量分散的针孔或未上锡的缺陷,且这些缺陷不得集中在同•，区域.PuttingthefeetofcapacitorintotheTinpotat235±5℃,keep2±0.5sec,checkingthefeetwithreadingglass,thefeetsurfaceshouldbecoverbyabedoflubricityandbrightsolderingtin,thefeetsurfaceallowtohavealittlepinholeanddonothavetindispersedly

8V.电解电容日ectrolyticcondenser

91.外观检验Visualinspection1.3检测设备Bziuipmentused:N/A1.4检测方法及要求!estingmethodanddemand:1.4.1元件包装标识必须与实际产品一致Thekite-markonpackagethatmustbeaccordingwiththeproduction元件表面印字标识应正确,清晰可见.用酒精棉擦拭表面后,不得有损伤,标识仍应清晰可见.Thekite-markmustbecorrectandclearonthesurface.Thekite-markmustbeclearaftersurfacecleaningwithalky2.外形尺寸Figuresizes:1.1检测设备&|uipmentused:数显游标卡尺Verniercaliper1.2检测方法及要求Testingmethodanddemand:根据厂商提供的规格说明书对元件尺寸进行测量,所测值不得超过规格书中规定的误差范围.Measuringthesizesaccordingasthespecificationwhichofferiedbythemanufacturer,themeasurementsmustbeintherangeonthespecification.3.性能检验Capabilitytesting3.1容量Capacity3.1.1检测设备Equipmentused:LCR数字电标LCRdigitalelectricbridge3.1.2检测方法及要求Testingmethodanddemand:将LCR数字电桥设置在测试电容状态,测量容量,所测值不得超过厂商提供的规格说明书中的误差范围.SetupLCRdigitalelectricbridgeintestingcapability,testingthecapabilitywithLCRdigitalelectricbridge,themeasurementsmustbeintherangeonthespecificationofmanufacturer.3.2散逸因素DF-Dissipationfactor3.2.1检测设备Equipmentused:LCR数字电桥LCRdigitalelectricbridge3.2.2检测方法及要求Testingmethodanddemand:根据厂商提供的规格说明书，设置测试条件,用LCR数字电桥测量DF值,所测值应符合规格说明书中的要求.Setupthetestingconditionaccordingasthespecificationofmanufacturer,testingtheDFwithLCRdigitalelectricbridge,themeasurementsmustbeaccordingwiththerequestinthespecification.3.3绝缘电阻!nsulationresistance3.3.1检测设备Equipmentused:绝缘电阻测量仪Insulationresistancetester3.3.2检测方法及要求Testingmethodanddemand:按厂商提供的规格说明书中设置测试电压及通电时间，用绝缘电阻测量仪测量绝缘电阻,所测结果必须符合规格说明书中的要求.Setupthetestingvoltageandtestingtimeaccordingasthespecificationofmanufacturer,thentesttheinsulationresistancewithinsulationresistancetester,themeasurementsmustbeaccording

10withtherequestinthespecification3.1漏电流:3.1.1测试设备&|uipmentused:漏电流测试仪:3.1.2测试方法及要求Testingmethodanddemand:按照厂商提供的规格说明书设置测试直流电压,其漏电流不得超出规格书中的要求。3.2可焊性Solderingtesting3.2.1检测设备Equipmentused:锡槽Tinpot,放大镜Fteadingglass3.2.2检测方法及要求Testingmethodanddemand:将电容器的引脚以纵轴方向浸渍到235±5℃的焊槽中,保持2±0.5sec取出,电容器的引脚经过浸渍过,表面必须覆盖有一层光滑明亮的焊锡,引脚表面只充许有少量分散的针孔或未上锡的缺陷,且这些缺陷不得集中在同一区域.PuttingthefeetofcapacitorintotheTinpotat235±5℃,keep2±0.5sec,checkingthefeetwithreadingglass,thefeetsurfaceshouldbecoverbyabedoflubricityandbrightsolderingtin,thefeetsurfaceallowtohavealittlepinholeanddonothavetindispersedly

11VIo整流二极管Siliconrectifierdiode

121.外观检验Visualinspection1.1检测设备B|uipmentused:N/A1.2检测方法及要奈Testingmethodanddemand:1.2.1元件包装标识必须与实际产品一致Thekite-markonpackagethatmustbeaccordingwiththeproduction1.2.2元件表面印字标识应正确,清晰可见.用酒精棉擦拭表面后,不得有损伤,标识仍应清晰可见.Thekite-markmustbecorrectandclearonthesurface.Thekite-markmustbeclearaftersurfacecleaningwithalky2.外形尺寸Figuresizes:2.1检测设备Equipmentused:数显游标卡尺Verniercaliper2.2检测方法及要求Testingmethodanddemand:根据厂商提供的规格说明书对元件尺寸进行测量,所测值不得超过规格书中规定的误差范围.Measuringthesizesaccordingasthespecificationwhichofferiedbythemanufacturer,themeasurementsmustbeintherangeonthespecification.2.性能检验Capabilitytesting3.1反向电流CountercurrentIr:3.1.1检测设备Ruipmentused:二极管反向电流测试仪Diodecountercurrenttester3.1.2检测方法及要求!estingmethodanddemand:按照厂商的规格书设置测试电压,将二极管放入测试仪上,由仪器上直接读取,此值不得超出规格书中要求.Adjustingtestingvoltageaccordingasthespecification,putthediodeonthetester,takereadfromthetesterdirectly,thereadmustbeintherangeonthespecification.3.2正向峰值电压Peakforwardvoltage3.3.1检测设备Equipmentused:二极管正向峰向电压测试仪Diodepeakforwardvoltage3.3.2将一.极管放入测试仪上,按照厂商的规格书微调测试电流,直到测试电流达到规格书上的测试条件,记录下反向峰值电压,此值不得超出规格书中要求Putthediodeonthetester,adjustingthetestingcurrentslowlytillthecurrentreachtherequestonspecification,recordthepeakforwardvoltage,thereadmustbeintherangeonthespecification.3.3可焊性Solderingtesting3.3.1检测设备&|uipmentused:锡槽Tinpot,放大镜Fteadingglass3.3.2检测方法.要求Testingmethodanddemand:将二极管的引脚以纵轴方向浸渍到235±5C的焊槽中,保持2±0.5sec取出,二极管的引脚经过浸渍过,表面必须覆盖有一层光滑明亮的焊锡,引脚表面只充许有少量分散的针孔或未上锡的缺陷,且这些缺陷不得集中在同一区域.PuttingthefeetofdiodeintotheTinpotat235±5℃,keep2±0.5sec,checkingthefeetwithreadingglass,thefeetsurfaceshouldbecoverbyabedoflubricityandbrightsolderingtin,thefeetsurface

13allowtohavealittlepinholeanddonothavetindispersedly皿・稳压二极管Voltagestabilizingdiode

141.外观检验Visualinspection检测设备&|uipmentused:N/A检测方法及要求!estingmethodanddemand:1.1.1元件包装标识必须与实际产品一致Thekite-markonpackagethatmustbeaccordingwiththeproduction1.1.2元件表面印字标识应正确,清晰可见.用酒精棉擦拭表面后,不得有损伤,标识仍应清晰可见.Thekite-markmustbecorrectandclearonthesurface.Thekite-markmustbeclearaftersurfacecleaningwithalky2.外形尺寸Figuresizes:2.1检测设备Equipmentused:数显游标卡尺Verniercaliper2.2检测方法及要求Testingmethodanddemand:根据厂商提供的规格说明书对元件尺寸进行测量，所测值不得超过规格书中规定的误差范围.Measuringthesizesaccordingasthespecificationwhichofferiedbythemanufacturer,themeasurementsmustbeintherangeonthespecification.3.性能检验Capabilitytesting3.1稳压电压vo代agestabilizationVz3.1.1检测设备Equipmentused:直流电源DCFtower,万用表Multimeter3.2.2检测方法及要求Testingmethodanddemand:根据厂商的规格说明书,在二极管两端施加一定电压(注:需在二极管上串ー限流电阻),用万用表测试二极管两端电压,此值应符合规格书耍求。InputaDCvoltageontwofeetondiodefollowasthespecification(Remark:mustseriesconnectionaresistor),testingthevoltageontwofeetofdiodewithmulimeter,thereadmustbeaccordingwiththespecification.3.2可焊性Solderingtesting3.2.1检测设备Equipmentused:锡槽Tinpot,放大镜Readingglass3.2.2检测方法友,要求Testingmethodanddemand:将二极管的引脚以纵轴方向浸渍到235±5C的焊槽中,保持2±0.5sec取出,二极管的引脚经过浸渍过,表面必须覆盖有一层光滑明亮的焊锡,引脚表面只充许有少量分散的针孔或未上锡的缺陷,且这些缺陷不得集中在同…区域.PuttingthefeetofdiodeintotheTinpotat235±5℃,keep2±0.5sec,checkingthefeetwithreadingglass,thefeetsurfaceshouldbecoverbyabedoflubricityandbrightsolderingtin,thefeetsurfaceallowtohavealittlepinholeanddonothavetindispersedlyVDI.快恢复二极管Fastrestorerdiode

151.外观检验Visualinspection1.1检测设备&|uipmentused:N/A1.2检测方法及要求！estingmethodanddemand:1.2.1元件包装标识必须与实际产品一致Thekite-markonpackagethatmustbeaccordingwiththeproduction元件表面印字标识应正确,清晰可见.用酒精棉擦拭表面后,不得有损伤,标识仍应清晰可见.Thekite-markmustbecorrectandclearonthesurface.Thekite-markmustbeclearaftersurfacecleaningwithalky2.外形尺寸Figuresizes:2.1检测设备Equipmentused:数显游标卡尺Verniercaliper2.2检测方法及要求Testingmethodanddemand:根据厂商提供的规格说明书对元件尺寸进行测量，所测值不得超过规格书中规定的误差范围.Measuringthesizesaccordingasthespecificationwhichofferiedbythemanufacturer,themeasurementsmustbeintherangeonthespecification.3.性能检验Capabilitytesting3.1反向漏电流CountercurrentIr:3.1.1检测设备Equipmentused:宜流电源DCPower,电流表日ectricalcurrentmultimeter3.1.2检测方法及要求Testingmethodanddemand:将电流表与二极管串联,按照厂商的规格书设置反向测试电压,由电流表上直接读取,此值不得超出规格书中要求.Seriesconnectionaelectricalcurrentmultimeterwiththediode,adjustingtestingvoltageaccordingasthespecification,takereadfromtheelectricalcurrentmultimeterdirectly,thereadmustbeintherangeonthespecification.3.2正向峰值电压Peakforwardvoltage3.2.1检测设备Equipmentused:二极管正向峰桎电压测试仪Diodepeakforwardvoltagetester3.2.2检测方法及要求Testingmethodanddemand:将二极管放入测试仪上,按照厂商的规格书微调测试电流,直到测试电流达到规格书上的测试条件,记录下正向峰值电压,此值不得超出规格书中要求Putthediodeonthetester,adjustingthetestingcurrentslowlytillthecurrentreachtherequestonspecification,recordthepeakforwardvoltage,thereadmustbeintherangeonthespecification.3.3恢复时间recoverytimeTrr:3.3.1检测设备Equipmentused:二极管恢复时间测试仪Dioderecoverytimetester3.3.2检测方法及要求Testingmethodanddemand:按照厂商的规格书设置测试条件,由二极管恢复时间测试仪上直接读出,此值不得超出规格书中要求

161.1可焊性Solderingtesting1.1.1检测设备日（uipmentused:锡槽Tinpot,放大镜Readingglass1.1.2检测方法及要求Testingmethodanddemand:将二极管的引脚以纵轴方向浸渍到235±5℃的焊槽中,保持2±0.5sec取出,二极管的引脚经过浸渍过,表面必须覆盖有一层光滑明亮的焊锡,引脚表面只充许有少量分散的针孔或未上锡的缺陷,且这些缺陷不得集中在同一区域.PuttingthefeetofdiodeintotheTinpotat235±5℃,keep2±0.5sec,checkingthefeetwithreadingglass,thefeetsurfaceshouldbecoverbyabedoflubricityandbrightsolderingtin,thefeetsurfaceallowtohavealittlepinholeanddonothavetindispersedly.IX.保险丝Fuse

171.タト观检验Visualinspection1.1检测设备Equipmentused:放大镜Readingglass1.2检测方法及要求Testingmethodanddemand:1.2.1元件包装标识必须与实际产品一致Thekite-markonpackagethatmustbeaccordingwiththeproduction1.2.2用50倍放大镜检查保险丝表面,不得有任何损坏及氧化现象Checkingthesurfaceofthefusewith50multiplereadingglass,itmustnothaveanydamageandoxidationonsurface.2.外形尺寸Figuresizes检测设备&|uipmentused:数显游标卡尺Verniercaliper检测方法及要求Testingmethodanddemand:根据厂商提供的规格说明书对元件尺寸进行测量,所测值不得超过规格书中规定的误差范围.Measuringthesizesaccordingasthespecificationwhichofferiedbythemanufacturer,themeasurementsmustbeintherangeonthespecification.3.性能检验Capabilitytesting3.1阻值Resistancevalue3.1.1检测设备Equipmentused:LCR数字电桥LCRbridgetester3.1.2检测方法及要求!estingmethodanddemand:将LCR数字电桥设置在测试电阻状态,测量电阻值,所测值不得超过电阻标识误差范围.Setupdigitalelectricbridgeintestingresistor,testingtheresistancewithLCRdigitalelectricbridge,themeasurementsmustbeintherangewhichmarkonthesurfaceoftheresistor.3.2熔断时间Operatingtime:3.2.1检测设备Equipmentused:恒流熔断时间测试仪Constantcurrentoperatingtimetester3.2.2检测方法及要求Testingmethodanddemand:按照厂商的规格说明书,设置测试电流,从仪器上直接读取数值,所测值必须符合规格书要求.Setupthetestingcurrentaccordingasthespecification,takereadsfromthetesterdirectly,thereadsmustbeintherangeonspecification.3.3可焊性Solderingtesting3.3.1检测设备Equipmentused:锡槽Tinpot,放大镜Readingglass3.3.2检测方法及要求Testingmethodanddemand:将保险丝的引脚以纵轴方向浸渍到235±5C的焊槽中,保持2±0.5sec取出,保险丝的引脚经过浸渍过,表面必须覆盖有一层光滑明亮的焊锡,引脚表面只充许有少量分散的针孔或未上锡的缺陷,且这些缺陷不得集中在同一•区域.PuttingthefeetoffuseintotheTinpotat235±5℃,keep2±0.5sec,checkingthefeetwithreadingglass,thefeetsurfaceshouldbecoverbyabedoflubricityandbrightsolderingtin,thefeetsurfaceallowtohavealittlepinholeanddonothavetindispersedly.

18IX•三极管Transistor抽样标准:GB2828计数抽样标准一般检查水平II,外观AQL=0.65,性能0.25SampleStandard:GB2828Samplelevel:II,VisualinspectionAQL=0.65,Capabilitytesting:0.25

191.1检测设备&|uipmentused:N/A1.2检测方法及要表Testingmethodanddemand:元件包装标识必须与实际产品一致Thekite-markonpackagethatmustbeaccordingwiththeproduction2.外形尺寸Figuresizes2.1检测设备&|uipmentused:数显游标卡穴Verniercaliper2.2检测方法及要求！estingmethodanddemand:根据厂商提供的规格说明书对元件尺寸进行测量,所测值不得超过规格书中规定的误差范围.Measuringthesizesaccordingasthespecificationwhichofferiedbythemanufacturer,themeasurementsmustbeintherangeonthespecification.3.性能检验Capabilitytesting3.1直流电流增益Hfe3.1.1检测设备Equipmentused:晶体管图示仪Transistorgraphicinstrument3.1.2检测方法及要求Testingmethodanddemand:依照厂商的规格说明书,设置测试条件Vee,lc,由晶体管图示仪上直接读出Hfe.所测结果必须符合规格书上的要求。SetuptheVeeandIcaccordingasthespecification,takereadingsfromthetransistorgraphicinstrument,thereadingsmustbeintherangeonthespecification.3.2集一发射极电压,基一发射极电压Vee,Vbe:3.2.1检测设备Equipmentused:晶体管图示仪Fransistorgraphicinstrument3.2.2检测方法及要求Testingmethodanddemand:依照厂商的规格说明书,设置测试条件Ic,lb,由晶体管图示仪上直接读出Vee,Vbe.所测结果必须符合规格书上的要求。SetuptheIc,lbaccordingasthespecification,takereadingsfromthetransistorgraphicinstrument,thereadingsmustbeintherangeonspecification.3.3可焊性Solderingtesting3.3.1检测设备Equipmentused:锡槽Tinpot,放大镜Readingglass3.3.2检测方法及要求Testingmethodanddemand:将引脚以纵轴方向浸渍到235±5℃的焊槽中,保持2±0.5sec取出,引脚经过浸渍过,表面必须覆盖有一•层光滑明亮的焊锡,引脚表面只充许有少量分散的针孔或未上锡的缺陷,且这些缺陷不得集中在同一区域.PuttingthefeetoffuseintotheTinpotat235±5℃,keep2±0.5sec,checkingthefeetwithreadingglass,thefeetsurfaceshouldbecoverbyabedoflubricityandbrightsolderingtin,thefeetsurfaceallowtohavealittlepinholeanddonothavetindispersedly.

20X.电感Inductor抽样标准:全检SampleStandard:Inspectionall.1.外观检验Visualinspection

211.1检测设备&|uipmentused:N/A1.2检测方法及要奈Testingmethodanddemand:目视产品,绝缘胶带表面及磁芯不得有破损,电感脚镀锡良好,电感含浸良好,磁芯不得松动.Checkingtheinsulatingtapeandmagneticcoresurfacethatdonothaveanydilapidation,tinningthefeetofinductancewell,donotallowthemagneticcorehaveanybecomelesscrowded.2.外形尺寸:(抽样标准:GB2828计数抽样标准一般检查水平II,外观AQL=0.65,性能0.25)Figuresizes：(SampleStandard:GB2828Samplelevel:II,VisualinspectionAQL=0.65,Capabilitytesting:0.25)2.1检测设备Equipmentused:数显游标卡尺Verniercaliper2.2检测方法及要求Testingmethodanddemand:根据厂商提供的磁芯及骨架规格说明书对元件尺寸进行测量,所测值不得超过规格书中规定的误差范围.Measuringthesizesaccordingasthespecificationofmagneticcoreandframeworkwhichofferiedbythemanufacturer,themeasurementsmustbeintherangeonthespecification.3.性能检验Capabilitytesting3.1电感量Inductance3.1.1检测设备Equipmentused:LCR数字电标LCRdigitalelectricbridge3.1.2检测方法及要求Testingmethodanddemand:将LCR数字电桥设置在测试电感状态及测试条件,然后测量电感量,所测值不得超过BOM中的误差范围.SetuptheLCRdigitalelectricbridgeundertestinginductance,thentestingtheinductance,thereadingsdonotallowtoovertherangeonBOM.3.2品质因数Q:3.2.1检测设备Equipmentused:LCR数字电桥LCRdigitalelectricbridge3.2.2检测方法及要求Testingmethodanddemand:将LCR数字电桥设置在测试电感状态及测试条件,然后测量Q值,所测值不得超过BOM中的误差范围.SetuptheLCRdigitalelectricbridgeundertestinginductance,thentestingtheQ,thereadingsmustbeintherangeonBOM.3.3耐压测试Hi-pottesting：3.3.1检测设备Equipmentused:耐压仪Hi-pottester3.3.2检测方法及要求Testingmethodanddemand:设置测试电压2KV,时间1S,漏电流5MA,然后对电感脚与电感包封面进行耐压试验,不得有耐压不良产品.Setupthetestingvoltage2kv,current5mA,testingtime1s,thentestingthefeetandinductancesurface,mustpassthetesting.

221.1可焊性Solderingtesting

231.1.1检测设备Equipmentused:锡槽Tinpot,放大镜Fleadingglass3.4.3检测方法左要求!estingmethodanddemand:将引脚以纵轴方向浸渍到235±5℃的焊槽中,保持2±0.5sec取出,引脚经过浸渍过,表面必须覆盖有一层光滑明亮的焊锡,引脚表面只充许有少量分散的针孔或未上锡的缺陷,且这些缺陷不得集中在同一区域.PuttingthefeetoffuseintotheTinpotat235±5℃,keep2±0.5sec,checkingthefeetwithreadingglass,thefeetsurfaceshouldbecoverbyabedoflubricityandbrightsolderingtin,thefeetsurfaceallowtohavealittlepinholeanddonothavetindispersedly.Xし集成块!C

241.1检测设备&|uipmentused:N/A1.2检测方法及要表Testingmethodanddemand:元件包装标识必须与实际产品一致Thekite-markonpackagethatmustbeaccordingwiththeproduction2.外形尺寸Figuresizes2.1检测设备Equipmentused:数显游标卡穴Verniercaliper2.2检测方法及要求！estingmethodanddemand:根据厂商提供的规格说明书对元件尺寸进行测量,所测值不得超过规格书中规定的误差范围.Measuringthesizesaccordingasthespecificationwhichofferiedbythemanufacturer,themeasurementsmustbeintherangeonthespecification.3.性能检验Capabilitytesting3.1参数测试Parametertesting3.1.1检测设备Equipmentused:镇流器分析仪Ballastparameteranalyzer.3.1.2检测方法及要求Testingmethodanddemand:将IC安装在镇流器上,然后测量镇流器参数,所测数值必须符合工程技术标准。InstallingtheICintotheballast,thentestingtheballastparameter,thereadingsmustbeintherangeontheengineeringstandard.3.2可焊性Solderingtesting3.2.1检测设备Equipmentused:锡槽Tinpot,放大镜Readingglass3.2.2检测方法及要求Testingmethodanddemand:将引脚以纵轴方向浸渍到235±5℃的焊槽中,保持2±0.5sec取出,引脚经过浸渍过,表面必须覆盖有一•层光滑明亮的焊锡,引脚表面只充许有少量分散的针孔或未上锡的缺陷,且这些缺陷不得集中在同一区域.PuttingthefeetoffuseintotheTinpotat235±5℃,keep2±0.5sec,checkingthefeetwithreadingglass,thefeetsurfaceshouldbecoverbyabedoflubricityandbrightsolderingtin,thefeetsurfaceallowtohavealittlepinholeanddonothavetindispersedly.XIIo'TerminalInspection

251.1检测设备&|uipmentused:N/A1.2检测方法及要表Testingmethodanddemand:元件包装标识必须与实际产品一致Thekite-markonpackagethatmustbeaccordingwiththeproduction1.3检查外观无破损Visuallycheckthatalltabsonleadconnectorsarenotbroken.1.4将导线插入端子孔中,轻轻拉并旋转,确定导线被牢固地锁在端子孔中Gentlypullandrotatewirestomakesurethattheyaresecureintheconnector.2.外形尺寸Figuresizes2.1检测设备Equipmentused:数显游标卡尺Verniercaliper2.2检测方法及要求！estingmethodanddemand:根据厂商提供的规格说明书对元件尺寸进行测量,所测值不得超过规格书中规定的误差范围.Measuringthesizesaccordingasthespecificationwhichofferiedbythemanufacturer,themeasurementsmustbeintherangeonthespecification.3.性能检验Capabilitytesting3.1推拉测试PulloutTestsonPush-InTerminals3.1.1检测设备Equipmentused:拉カ计Pulltester3.1.2检测方法及要求Testingmethodanddemand:使用ー89牛的拉カ或4倍的产品重量,但至少不小于22牛的拉力持继1分钟,端子不应损坏变形。Aforceof20pound(89N)orfourtimestheweightofballast,whicheverislessbutnotlessthan5pounds(22N)istoapplytotheballastundertestfor1minute.Theterminalsshouldnotbreak,bedamagedorpermanentlydistorted.4.耐压测试Hi-pottesting：4.1检测设备Equipmentused:耐压仪Hi-pottester4.2检测方法及要求！estingmethodanddemand:设置测试电压2KV,时间1S,漏电流5MA,然后对电感脚与电感包封面进行耐压试验,不得有耐压不良产品.Setupthetestingvoltage2kv,current5mA,testingtime1s,thentestingthefeetandinductancesurface,mustpassthetesting.或使用下列测试方法Ortestedwiththemethodinthefollowing.使用2倍的最大输入电压+1000V的测试电压与相邻两插脚持继1分钟,端子不应被击穿Applythedielectricpotentialwhichequaltotwicethemaximumballastratedvoltageplus1000voltstoterminalsfor1minute.Theterminalshouldnotbedielectricbreakdown.5.温升测试TemperatureTest使用90%的最小额定电压,将装有端子的镇流器使用最大负载,在25度环境中测量,端子温升应小于55度。(注:测量时需待温度稳定后读数。具体如下,需让镇流器运行15分钟,然后每隔15分钟读数一次,连继2次读数误差小于1度时既为稳定)Apply90%oflowestratedinputvoltagetoballastandletballasttoreachconstantcasetemperature.Thentestterminaltemperature,whichshouldbelowerthan55℃basedonanambienttemperatureof25℃.Pleasenotesneedtotestthecaseeverything15minuntilthevariationoftemperaturebetweentwocontinuousmeasurementslessthan

261degreeC.20080909附录

27A.电感新增检验项目1.漆包线线径线径及多股线股数的检验:检查电感所用漆包线线径及多股线的股数符合BOM清单要求。2.对于多股线绕制的电感检查每3层是否有用3层绝缘胶带进行包扎。3.所绕电感铜线要排列均匀整齐,松紧适宜,不得交叉、杂乱、打结等不良现象。4.所绕制的电感,每个线圈的起始点和结尾点必须符合电感绕制作业指导书。注:ACE检验人员,从成品中随机抽样25个样品,如有・・个不符合要求,则进行加抽。如样本达到100个时,有一个不合格,则该批均判为不合格。B,新增外壳检验程序（仅适用金属外壳）1.镇流器外壳不得变形，所有焊接点不得有裂痕。2.镇流器外壳表面无毛刺,无脱漆,无污渍,无气泡,无刮痕。3.几何尺寸:测量外壳尺寸,必须符合外形尺寸图纸。4,合格的成品镇流器,上下盖不应有明显的松动。5.合格的成品镇流器上下盖之间不应有明显的缝隙,单个缝应小于3.23平方毫米,累计面积不超过161.29平方毫米。5,合格的成品外壳在任何无工具的情况下,均不能用手打开。6.合格的成品镇流器上下盖之间刮掉漆后用万用表电阻档测量,必须是相互导通的7.附着力测试：在烤漆面上50X100毫米的范围内用裁纸刀划15X15毫米的格子,然后将胶布贴在划了格子的漆面上。用500G负荷的棍子或手指压紧,然后以手持胶带一端,按与涂层表面垂直的方向,以迅速又突然的的方式将胶带拉开,检查涂层是否被胶带粘起而剥离。未发生剥离为合格,如果剥离发生在涂层间也视为合格,剥离发生在金属与涂层间视为不合格。8.跌落实验：按照GB4943—2001要求,高度为1000+/—10mm,跌落镇流器不应被打开。注：ACE检验人员,从成品中随机抽样25个样品,如有一个不符合要求,则进行加抽。如样本达到100个时,有一个不合格，则该批均判为不合格。9.镇流器外壳厚度（不包括涂漆层）不得低于0.66毫米。10.对于外壳刮痕及污渍要求如下,检测方法目视检测,距产品约30cm,目视3秒，表面不得有明显刮痕及污渍。轻微刮痕要求刮痕深度不可见漆层下面的金属材质,刮痕处必须干净应与未有刮痕处颜色ー致,不得有异色。对于污渍,表面允许有少许无法去除的污渍如喷漆时所造成的，允许有3处,单个不得超出1平方毫米。更新记录:1.2008/11/7更新外壳检验标准第9和10条。