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1、CeramicBallGridArrayAssemblyReliabilityinMilitaryApplicationsTomScheler,PuligandlaViswanadham,MarcA.Garza,SteveDunford,andBrookThomasRaytheonSystemsCompanyAbstract-Ballgridarraypackages(BGA)offerasignificantincreaseininterconnectdensitywhilereducingthesizeandweightofthe
2、package.Theseadvantagesaresignificantinmilitaryairborneelectronicsapplicationswheretheboardrealestateisatapremium,weightconsiderationsarecritical,andmaximumperformanceisdemanded.However,themilitaryenvironmentpresentsseverepackage-to-boardinterconnectionreliabilitychalle
3、ngesforlowcompliancepackagessuchastheballgridarraypackages.Thisstudyencompassesthedevelopmentofadimpledceramicballgridarraypackage(DBGA)applicationforamilitaryairborneprogram.Thepurposeistodemonstratethatthistechnologyandtheassociatedfabricationandassemblytechniquesares
4、uitableandadequateformilitaryenvironments.Anoverviewofthetesthardwarethatincorporatestwotypesofballmountingpaddesignsandtheassembly,andreworkprocesswillbeprovided.Reliabilityevaluationsincludethermalcyclingvibrationandshocktesting.Testenvironmentsaredelineatedandthetest
5、regimensarediscussed.Reliabilitylifecurvesderivedfromthetestdatawillbepresented.Itwasdeterminedthattheballgridarraypackageandprintedwiringboardcombinationtestedcanmeetthereliabilitychallengesofthemilitaryapplication.Keywords:BallGridArray,DimpleBGA,Assembly,Rework,Board
6、LevelReliability,ThermalCycling,Shock,VibrationI.INTRODUCTIONapplication.AhighyieldassemblyandreworkprocesswasBallgridarraypackagescontinuetobethepackagesofdeveloped.CircuitCardAssembly(CCA)reliability,bothchoiceinpreferencetohighinput-output(I/O)finepitchthermalandmech
7、anical,farinexcessoftheproductquadflatpacksduetotheirnumerousandobviousad-requirementwasdemonstrated.vantages.Considerableamountofpackage,assembly,andreliabilitydataareavailableintheliterature[1,2]andareII.EXPERIMENTALconstantlybeinggenerated.Thereishardlyanymicro-elect
8、ronicsconferencethatdoesnothaveasessiononballII.1TheTestModulegridarraytechnology.ThecommercialandconsumerThee
