生产注意事项（一）ppt课件.ppt

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1、PCBA生產注意事項(一)目　綠一、IC元件外形及重要尺寸規格二、SMT組裝及PCBA測試要求一、IC元件外形及重要尺寸規格1.1IC元件外形簡介(ICDevicesIntroduction)1.2208PQFP重要尺寸規格介紹1.3476PBGA重要尺寸規格介紹1.4TheStructureofSolderSpheretoSubstrate1.5TransformationofBGASolderSphereinReflow1.1IC元件外形簡介(ICDevicesIntroduction)ThroughHolePackageSurfaceMountedPackageKBG

2、A(BallGridArray)FlipChipL1.2208PQFP重要尺寸規格介紹(MechanicalSpecifications)BentLeadSpec.VT82C586BYYWWRRTAIWANLLLLLLLLLCMY=DateCodeYearW=DateCodeWeekR=ChipRevisionL=LotCodeTheImportantSpecificationsforQFP:1.LeadCo-planarity:USL:4.0mils.2.LeadSpan:USL:6.5mils.3.BentLead:USL:+3mils,LSL:-3mils.4.QFP

3、Packagewarpage:USL:4mils.5.LQFPPackagewarpage:USL:3mils.(1)USL:UpperSpec.Limit.(2)LSL:LowerSpec.Limit.(3)1mil=0.0254mm.LeadCo-planaritySpec.1.3476PBGA重要尺寸規格介紹(MechanicalSpecifications):SolderBallDiameterTrueballpositionerrorTheImportantSpecificationsforBGA:1.SolderBallCo-planarity:US

4、L=5.5mils2.Trueballpositionerror:USL=+6.0mils,LSL=-6.0mils3.Balldiameter:USL=35mils,LSL=24mils4.Packagewarpage:USL=3.5mils5.SolderBallHeight:USL=28mils,LSL=19mils.SolderBallCo-planaritySolderBallHeight1.4TheStructureofSolderSpheretoSubstrateBT-RESINPAD(Cu)Plating(Ni)Plating(Au)SolderBall(S

5、n/Pb)SolderMaskSolderMaskOriginalBT-RESINPAD(Cu)IMClayer(IntermetalicCompound,Au/Ni/Sn/Pb)SolderBall(Sn/Pb)SolderMaskSolderMaskAfterReflow1.5TransformationofBGASolderSphereinReflowSolderBallSolderBallscollapseduringreflowCanbereflowedwithjustfluxWillselfcenterduringreflowprocessNocleanflux

6、recommendedPBGASolderBalls0.030’’(0.76mm)0.016’’(0.41mm)**BGASubstratePCB/PWBSolderSphereCollapseCoplanarityissuearevirtuallyeliminatedwiththefinalcollapse**Thefinalheightwillvarywithpadsizeandsolderpastedeposition.(0.60mm)二、SMT組裝及PCBA測試要求2.1SMTREFLOWPROCESS/流焊製造程序2.2鋼板(Stencil)種類與比較2.3SMT

7、鋼板:厚度及開孔尺寸設計及使用要領2.4鋼板印刷的製程參數有2.5SMT組裝過程注意事項2.6AOI光學檢查要求2.7PCBA測試要求2.1SMTREFLOWPROCESS/流焊製造程序錫膏印刷(StencilPrinting)點膠(Dispensing)Optional置放(Placement)迴焊(Reflow)2.2鋼板(Stencil)種類與比較鋼板種類製作時間製作成本板孔形狀孔壁Undercut上錫性激光鋼板快較貴較光滑較少較佳化學鋼板慢較便宜較粗糙較多較差2.3SMT鋼板:厚度及開孔尺寸設計及使用要領(