圆片级封装介绍(wafer level packaging).pdf

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1、BumpingDesignGuideRevised:May,2007©CopyrightFlipChipInternationalLLC,2007Unauthorizeduseorreproductionofanypartofthisdocumentisprohibited.TableofContents1CONTACTINFORMATION.............................................................................12INTRODUCTI

2、ON..........................................................................................32.1Overview..........................................................................................................................32.2History........................

3、.....................................................................................................33CHOOSINGABUMPINGPROCESS.................................................................53.1StandardFlipChip–BumponI/O........................................

4、...............................................53.1.1StandardFlipChip-BumponI/OProcessSummary............................................................63.1.2I/OrequirementsfortheSFC-BumponI/Oprocess...........................................................73

5、.2StandardFlipChip--Repassivation........................................................................................83.2.1SFC-RepassivationProcessSummary................................................................................93.3StandardFlipChip--R

6、edistribution.....................................................................................103.3.1SFC-RedistributionProcessSummary.............................................................................10TM3.4SpheronWLCSP............................

7、................................................................................123.4.1SpheronWLP™RedistributionProcessFlow....................................................................12®3.5UltraCSP........................................................

8、...............................................................143.5.1UltraCSPProcessSummary.................................................................................