光刻工艺中的焦距异常发生原因分析及解决办法.pdf

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1、目录摘要····························································lAbstract·················································-··········3第一章半导体光刻技术···············································5第一节光刻工艺技术发展及展望····································5第二节光刻基本原理及成像条件·····················

2、···········““6第三节光阻化学性质与作用····································“”6第四节光刻工艺流程介绍··········································81．4．1去水烘烤／HMDS············································91．4．2光阻涂布··················································91．4．3软烤·································

3、·················一·．131．4．4晶边曝光WEE(WaferEdgeExposure)························141．4．5对准／曝光·············································一“141．4．6曝光后烘烤················································171．4．7显影···········”··”············一·················．．····181．4．8硬烤·············

4、······．．”···”·······”················．18第五节光阻涂布与显影设备····························一·····“·191．5．1Track机台及构造··········································191．5．2涂布机台及构造···········································"201．5．3显影机台·················································Q1第六节曝光设备····

5、·····一······一一·“”一···””····一．．·一一211．6．1leveling系统··············································Q2第七节解析度与聚焦深度································“····“23第八节光罩相关技术············································24第九节显影后的检查·····················“·····一“············251．9．1显影后检查步骤··········

6、·································．251．9．2显影后目检(ADI．AfterDevelopInspection)····················．251．9．3ADI的常见缺陷···········································．26第二章典型焦距异常现象及其原因分析································28第一节如何确定光刻参数········································282．1．1光阻的选择········

7、·······································282．1．2光阻厚度曲线(SwingCurve)·······························Q92．1．3最佳焦距与曝光能量·······································"292工4制程窗口。P∞cess讹d。w)．．．．．．．．．．．．．．．．．{IYIIIIIIIllllllll9111111611LIIl7IIIIIl5IIIIIL5tlllll攀第二节光刻中三种典型的焦距异常现象及原因分析·············

8、·····332．2．1Localdefocus······························