光刻工艺中的焦距异常发生原因分析及解决办法

光刻工艺中的焦距异常发生原因分析及解决办法

ID:9022539

大小:2.15 MB

页数:53页

时间:2018-04-15

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1、目录摘要····························································lAbstract·················································-··········3第一章半导体光刻技术···············································5第一节光刻工艺技术发展及展望····································5第二节光刻基本原理及成像条件·····

2、···························““6第三节光阻化学性质与作用····································“”6第四节光刻工艺流程介绍··········································81.4.1去水烘烤/HMDS············································91.4.2光阻涂布··················································91.4.3软烤·

3、·················································一·.131.4.4晶边曝光WEE(WaferEdgeExposure)························141.4.5对准/曝光·············································一“141.4.6曝光后烘烤················································171.4.7显影···········”··”··········

4、··一·················..····181.4.8硬烤···················..”···”·······”················.18第五节光阻涂布与显影设备····························一·····“·191.5.1Track机台及构造··········································191.5.2涂布机台及构造···········································"201.5.3显影

5、机台·················································Q1第六节曝光设备·········一······一一·“”一···””····一..·一一211.6.1leveling系统··············································Q2第七节解析度与聚焦深度································“····“23第八节光罩相关技术········································

6、····24第九节显影后的检查·····················“·····一“············251.9.1显影后检查步骤···········································.251.9.2显影后目检(ADI.AfterDevelopInspection)····················.251.9.3ADI的常见缺陷···········································.26第二章典型焦距异常现象及其原因分析·········

7、·······················28第一节如何确定光刻参数········································282.1.1光阻的选择···············································282.1.2光阻厚度曲线(SwingCurve)·······························Q92.1.3最佳焦距与曝光能量·······································"292工4制程窗口。P∞ces

8、s讹d。w).................{IYIIIIIIIllllllll9111111611LIIl7IIIIIl5IIIIIL5tlllll攀第二节光刻中三种典型的焦距异常现象及原因分析··················332.2.1Localdefocus······························

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