PCB线路板行业专业术语.doc

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1、PCB线路板行业专业术语laminates(phenolic/paperccl)40、环氧纸质覆铜箔板：epoxidecellulosepapercopper-cladlaminates(epoxy/paperccl)41、环氧玻璃布基覆铜箔板：epoxidewovenglassfabriccopper-cladlaminates42、环氧玻璃布纸复合覆铜箔板：epoxidecellulosepapercore,glassclothsurfacescopper-cladlaminates43、环氧玻璃布玻璃纤

2、维复合覆铜箔板：epoxidenonwoven/wovenglassreinforcedcopper-cladlaminates44、聚酯玻璃布覆铜箔板：ployesterwovenglassfabriccopper-cladlaminates45、聚酰亚胺玻璃布覆铜箔板：polyimidewovenglassfabriccopper-cladlaminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxidewovenglassfabriccopper-cl

3、adlamimates47、环氧合成纤维布覆铜箔板：epoxidesyntheticfiberfabriccopper-cladlaminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiberglasscopper-cladlaminates49、超薄型层压板：ultrathinlaminate50、陶瓷基覆铜箔板：ceramicsbasecopper-cladlaminates51、紫外线阻挡型覆铜箔板：uvblockingcopper-cladlaminatesSAYFUPRODUCTTYPE产

4、品类型■高频印制板（ＨＦＰＣＢ）：适用微波传输电子产品HighfrequencyPCB(HFPCB):suitableforelectricproductswithmicrowavetransmission■双面印制板（DPCB）：基材FR4Double-sidedPCB(DPCB):withbasematerialofFR4■多层印制板(MPCB)：基材FR4、PPMulti-layerPCB(MPCB):withbasematerialofFR4andPP■高密度印制板（HDIPCB）：含埋/盲孔，适用B

5、GA电子产品High-densityPCB(HDIPCB):includingbuilt-in/blindholes,whichissuitableforBGAelectricproducts■铝基印制板：贝格斯铝基板，适用大功率散热电子产品BergquistAluminumbasedboard:suitableforelectricproductswithhighpowerheatdissipation■多层盲孔板：适用仪器电子产品Highandmultilayerprintedcircuitboardwi

6、thblind&buriedviaboards:suitableforinstrumentelectricproduct■厚铜板（3-10Oz）和厚金板：适用电源产品Heavycopperboards(3-10Oz)andheavygoldboard:suitableforpowerprintedcircuitboardproduct■软硬结合板：适用电脑、工业控制产品Rigid-flexorFlex-rigidboards:suitableforcomputerandindustrycontrolprodu

7、cts.■软板(柔性线路板)：适用电脑、工业控制产品Flexibleprintedcircuitboards(FPCB):suitableforcomputerandindustrycontrolproducts.(Note:SAYFUPCBspeciallyproducesonrigidprintedcircuitboard;printedwiringboard;mulitlayerprintedcircuitboard;flex-rigidprintedboard,rigid-flexprintedboa

8、rd;metalcoreprintedboard;metalbaseprintedboard;heavycoppercoard;powerprintedcircuitboard;heavygoldboard;Flexibleboard/FlexPCB;BergquistAluminumbasedboard/AlPCB;MetalCorePCB;PCB/PWB/FPCB/FPC/MPCB/Rigid-