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1、铝基板技术参数产品简介産品簡介PRODUCTSINTRODUCTION産品類型Class型号Type特性簡要描述Features鋁基覆銅闆GM-AL系列AluminumSubstrateCopperCladLaminateGM-ALSeriiesAL-M-01鋁基、銅箔、FR4玻纖布，Tg130-170℃Aluminumsubstrdteandcopperfoil,FR4fiberglassTg130-170℃AL-H-02鋁基、銅箔、無玻纖（Laird）,熱傳導率3.0w/n..k.。Aluminumsubstrateandc
2、opperfoil,no-fiberglass,thermalconductivity(Laird)3.0w/m..kAL-H-03鋁基、銅箔、無玻纖（NRK）,熱傳導率2.0w/n..k.。Aluminumsubstrateandcopperfoil,no-fiberglass,thermalconductivity(NRK)2.0w/m..kAL-H-04鋁基、銅箔、無玻纖,耐熱350℃10min、介紹常數4.2Aluminumsubstrateandcopperfoil,no-fiberglass,enduring10mi
3、nat350℃,dielectricconstant4.2AL-H-05鋁基、銅箔、無玻纖(Bergquist)熱傳導率2.0w/n..k.。Aluminum,coperfoil,no-fiberglass(Bergquist)thermalconductivity2.0w/m..k特種覆銅版GM-CU系列CU-M-01覆厚銅箔（4oz～10oz）闆，大電流。SpecialSeriesCopperCladLaminateGM-CU大功率電路。Thickcoppercladlaminate(40z～100z),super-curr
4、ent,Super-powercircuit.特點：用途:●良好得散熱性●LED照明電路●優良的尺寸穩定性●厚膜混合集成電路●良好的機械加工性●電源電路●電磁波的屏蔽性●固态繼電器●優良的性價比Features:Applications:●Excellentthermalconductivity.●LEDlighting.●Excellentdimensionalstability●Thickfilmhybridintegratedcircuits.●Excllentmachinability.●Powersuppiy●Exce
5、llentelectromagneticshielding.●Solidrelay●Highcostperformance 性能指标性能指标PERFORMANCE項目Iten實驗條件Testcondition單位Units典型值AL-M-01AL-H-02AH-H-3AL-H-4AL-H-5熱傳導率ThermalConductivityAW/m.k≤1.0322.52剝離強度PeelStrengthA熱應力後AfterthermalstressN/mm1.51.00.91.31.51.51.00.91.31.5熱應力Therma
6、lStress288℃不分層、不起泡No-delimitation,No-blisteringS150S150S120S10min150S表面電阻SurfaceResistanceC-96/35/90E-24/125MΩ體積電阻率VolumeResistanceC-96/35/90E-24/125MΩ.cm電氣強度ElectricalStrengthAKV/mm3030303030燃燒性FlameabilityUL94－v-0v-0v-0v-0v-0TgA℃130-170105130130130吸水率MoisturAbsorpt
7、ionD-24/23$0.10.030.030.030.03CT1IEC6012V200250600600600 基本结构 導電層--由銅箔組成 絕緣層--分爲有玻纖和無玻纖兩種金屬基層--鋁闆、銅闆等 CircuitLayer--CopperfoilDielectiricLayer--Fiberglasssupport&UnsupportMetalSubstrate--Aluminum,Copper.etc基本結構STRUC
8、TURE标準尺寸Size層Layer材料Material18″×24″16″×18″導電層CircuitLayerHoz1oz2oz3oz4oz6oz10oz18um35um70um100um137um206um343um絕緣層DielscLayer50um、7
