PCB制作流程介绍课件.ppt

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1、印刷電路板流程介紹(Pattern)教育訓練教材要項流程簡介流程管控、參數及制程能力表面處理之淺談Q＆A顧客(CUSTOMER)工程製前(FRONT-ENDDEP.)裁板(LAMINATESHEAR)內層乾膜(INNERLAYERIMAGE)預疊板及疊板(LAY-UP)通孔電鍍(P.T.H.)液態防焊(LIQUIDS/M)外觀檢查(VISUALINSPECTION)成型(FINALSHAPING)業務(SALESDEPARTMENT)生產管理(P&MCONTROL)蝕銅(I/LETCHING)鑽孔(

2、PTHDRILLING)壓合(LAMINATION)外層乾膜(OUTERLAYERIMAGE)二次銅及錫鉛電鍍(PATTERNPLATING)蝕銅(O/LETCHING)檢查(INSPECTION)噴錫(HOTAIRLEVELING)電測(ELECTRICALTEST)出貨前檢查(OQC)包裝出貨(PACKING&SHIPPING)曝光(EXPOSURE)壓膜(LAMINATION)前處理(PRELIMINARYTREATMENT)顯影(DEVELOPIG)蝕銅(ETCHING)去膜(STRIPPI

3、NG)黑化處理(BLACKOXIDE)烘烤(BAKING)預疊板及疊板(LAY-UP)壓合(LAMINATION)後處理(POSTTREATMENT)曝光(EXPOSURE)壓膜(LAMINATION)二次銅電鍍(PATTERNPLATING)錫鉛電鍍(T/LPLATING)去膜(STRIPPING)蝕銅(ETCHING)剝錫鉛(T/LSTRIPPING)塗佈印刷(S/MCOATING)預乾燥(PRE-CURE)曝光(EXPOSURE)顯影(DEVELOPING)後烘烤(POSTCURE)多層板內層

4、流程(INNERLAYERPRODUCT)MLB全板電鍍(PANELPLATING)銅面防氧化處理(OSP(EntekCu106A)外層製作(OUTER-LAYER)TENTINGPROCESS鍍金手指(G/FPLATING)鍍化學鎳金(E-lessNi/Au)ForO.S.P.選擇性鍍鎳鍍金(SELECTIVEGOLD)印文字(SCREENLEGEND)網版製作(STENCIL)圖面(DRAWING)工作底片(WORKINGA/W)製作規範(RUNCARD)程式帶(PROGRAM)鑽孔,成型機(D

5、.N.C.)底片(MASTERA/W)磁片,磁帶(DISK,M/T)藍圖(DRAWING)資料傳送(MODEM,FTP)AOI檢查(AOIINSPECTION)除膠渣(DESMER)通孔電鍍(E-LESSCU)DOUBLESIDE前處理(PRELIMINARYTREATMENT)前處理(PRELIMINARYTREATMENT)前處理(PRELIMINARYTREATMENT)全面鍍鎳金(S/GPLATING)雷射鑽孔(LASERABLATION)BlindedVia(1)前製程治工具製作流程顧客C

6、USTOMER裁板LAMINATESHEAR業務SALESDEP.生產管理P&MCONTROL資料傳送MODEM,FTP網版製作STENCILDRAWING圖面RUNCARD製作規範PROGRAM程式帶鑽孔,成型機D.N.C.工程製前FRONT-ENDDEP.工作底片WORKINGA/W(2)多層板內層製作流程曝光EXPOSURE涂布ROLLCOATING前處理PRELIMINARYTREATMENT去膜STRIPPING蝕銅ETCHING顯影DEVELOPING棕化處理BROWNOXIDE烘烤BA

7、KINGLAY-UP預疊板及疊板後處理POSTTREATMENT壓合LAMINATION內層乾膜INNERLAYERIMAGE預疊板及疊板LAY-UP蝕銅I/LETCHING鑽孔DRILLING壓合LAMINATION多層板內層流程INNERLAYERPRODUCTMLBAOI檢查AOIINSPECTION裁板LAMINATESHEARDOUBLESIDE雷射鑽孔LASERABLATIONBlindedVia(3)外層製作流程通孔電鍍P.T.H.鑽孔DRILLING外層乾膜OUTERLAYERIMA

8、GE二次銅及錫鉛電鍍PATTERNPLATING檢查INSPECTION前處理PRELIMINARYTREATMENT二次銅電鍍PATTERNPLATING蝕銅ETCHING全板電鍍PANELPLATING外層製作OUTER-LAYERO/LETCHING蝕銅TENTINGPROCESSDESMER除膠渣E-LESSCU通孔電鍍前處理PRELIMINARYTREATMENT剝錫鉛T/LSTRIPPING去膜STRIPPING壓膜LAMINATION錫鉛電鍍T/LPLA