LED 封装生产流程介绍课件.ppt

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1、․原物料/Materials․生產流程/ProcessFlow大綱/Outline原物料/Materials1:晶片/Die2:支架/Leadframe3:固晶膠/ResinofdicemountChip,如：絕緣膠/InsulationZener,如：銀膠/SilverEpoxy4:金線/Goldwire5:封裝膠/Resinofencapsulation如:環氧樹脂/Epoxy，矽氧樹脂/silicone6:螢光粉/PhosphorDieAttachCuringWireBondEncapsulationCuringSingulat

2、ionTestingTapingPackagingShippingLEDmanufacturingprocess生產流程/ProcessFlow固晶/Diemounting固晶烤膠/GlueCuring品保控管/IPQCGate銲線/WireBonding品保控管/IQC․晶片/Die․支架/LeadFrame․固晶膠/Resinofdicemount․金線/Goldwire生產流程/ProcessFlow支架預熱/Preheating封膠/Encapsulation抽真空/Vacuumize配膠/Mixing烤膠/PostCurin

3、g品保控管/IPQCGate品保控管/IPQCGate․封裝膠/Resinofencapsulation․其他/Others:如:螢光粉,染劑/Example:Phosphor,Dye生產流程/ProcessFlow成單顆/Singulation測試/Testing外觀/VisualInspection品保控管/FQCGate生產流程/ProcessFlow捲包裝後外觀/FVI品保控管/IPQCGate捲包裝/Taping捲包裝烘烤/DryBaking生產流程/ProcessFlow包裝/Packing品保控管/OQA標籤列印/Lab

4、elPrintingDieattachMachineAutoBondMachineEncapsulationMachineTrim&FormMachineTestMachineTapeMachineTheEndThankYouVeryMuch