电子技术专业英语教学课件作者何茗unit16.ppt

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1、Unit16MicroelectronicPackagingPackagingPackagingisthescienceofestablishinginterconnectionswithelectricalcomponentssuchastransistors,diodes,capacitors,andresistorstoformcircuits.Theindividualcircuitsmustbeinterconnectedtoformfunctionalentities.Achipcommunicateswithotherchipsinthecircuitthroughan

2、input/output(I/O)systemofinterconnects,andthechipanditscircuitryaredependentonthepackageforsupportandprotection.下一页返回Unit16MicroelectronicPackagingIndeed,majorfunctionsofthepackagearetoprovideapathfortheelectricalcurrentthatpowersthecircuitonthechip,distributethesignalstoandfromthechip,dissipat

3、etheheatgeneratedbythecircuit,andprovidemechanicalsupportandenvironmentalprotectiontothecomponentsandinterconnections.Theobjectiveofmicroelectronicpackagingistoensurethatthechipsandinterconnectionsarepackagedefficientlyandreliably.下一页上一页返回Unit16MicroelectronicPackagingTraditionally,interconnec

4、tionswithinachiphavebeenconsideredoutsidetherealmofpackagingtechnologies.However,withincreasingintegration,asteadilyincreasingpercentageofwiringismigratingintothechip,thusmakingthesemiconductorthinfilmwiringaveryimportantaspectofmicroelectronicpackaging.Figure2.6.1showsatypicalpackaginghierarch

5、y.Chiplevel(zerolevel)packagingincludeschipmetallization,andprovisionsforchippackageinterconnection.Thefirstlevelpackagingistheassemblyofchipandsubstrate(organicorceramicpackage)toformasingleoramultiplechipmodule.Insomecaseschipsmaybedirectlyattachedtothecard(chiponboard,COB).下一页上一页返回Unit16Micr

6、oelectronicPackagingThesecondlevelpackagingistheassemblyofchipmodulesandothercomponentsonPCBs.Thethirdlevelpackagingdiffers;dependingonthesophisticationofthesystemitmayinvolveseveralPCBspluggedintoamotherboard.Thechiplevelorwaferlevelpackaginggenerallyfocusesonsolderbumpsforflipchiptechnologyan

7、disalsoknownaszerolevelpackaging.Inordertoemphasizethechangingtrendsinchiplevelpackaging,inthisunitthechiplevelpackagingwillincludeinterconnectmetallization,andprovisionsforchippackageinterconnectionsuchasflipchipbumping,wirebondi