封装类型缩写含义.doc

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1、封装类型SIP：Single-In-LinePackageDIP：DualIn-linePackage双列直插式封装CDIP：CeramicDual-In-linePackage陶瓷双列直插式封装PDIP：PlasticDual-In-linePackage塑料双列直插式封装SDIP：ShrinkDual-In-LinePackageQFP：QuadFlatPackage四方扁平封装TQFP：ThinQuadFlatPackage薄型四方扁平封装PQFP：PlasticQuadFlatPacka

2、ge塑料方型扁平封装MQFP：MetricQuadFlatPackageVQFP：VeryThinQuadFlatPackageSOP：SmallOutlinePackage小外型封装SSOP：ShrinkSmall-OutlinePackage缩小外型封装TSOP：ThinSmall-OutlinePackage薄型小尺寸封装TSSOP：ThinShrinkSmall-OutlinePackageQSOP：QuarterSmall-OutlinePackageVSOP：VerySmallOut

3、linePackageTVSOP：VeryThinSmall-OutlinePackageLCC：LeadlessCeramicChipCarrier无引线芯片承载封装LCCC：LeadlessCeramicChipCarrierPLCC：PlasticLeadedChipCarrier塑料式引线芯片承载封装BGA：BallGridArray球栅阵列CBGA：CeramicBallGridArrayuBGA：MicroBallGridArray微型球栅阵列封装PGA：PinGridArrayCP

4、GA：CeramicPinGridArray陶瓷PGAPPGA：PlasticPinGridArrayMCM：MultiChipModel多芯片模块SMD(surfacemountdevices)——表面贴装器件。SOIC(smallout-lineintegratedcircuit)——双侧引脚小外形封装集成电路QFP(QuadFlatPockage)——四侧引脚扁平封装