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ID:53448616
大小:21.50 KB
页数:1页
时间:2020-04-03
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1、封装类型SIP:Single-In-LinePackageDIP:DualIn-linePackage双列直插式封装CDIP:CeramicDual-In-linePackage陶瓷双列直插式封装PDIP:PlasticDual-In-linePackage塑料双列直插式封装SDIP:ShrinkDual-In-LinePackageQFP:QuadFlatPackage四方扁平封装TQFP:ThinQuadFlatPackage薄型四方扁平封装PQFP:PlasticQuadFlatPacka
2、ge塑料方型扁平封装MQFP:MetricQuadFlatPackageVQFP:VeryThinQuadFlatPackageSOP:SmallOutlinePackage小外型封装SSOP:ShrinkSmall-OutlinePackage缩小外型封装TSOP:ThinSmall-OutlinePackage薄型小尺寸封装TSSOP:ThinShrinkSmall-OutlinePackageQSOP:QuarterSmall-OutlinePackageVSOP:VerySmallOut
3、linePackageTVSOP:VeryThinSmall-OutlinePackageLCC:LeadlessCeramicChipCarrier无引线芯片承载封装LCCC:LeadlessCeramicChipCarrierPLCC:PlasticLeadedChipCarrier塑料式引线芯片承载封装BGA:BallGridArray球栅阵列CBGA:CeramicBallGridArrayuBGA:MicroBallGridArray微型球栅阵列封装PGA:PinGridArrayCP
4、GA:CeramicPinGridArray陶瓷PGAPPGA:PlasticPinGridArrayMCM:MultiChipModel多芯片模块SMD(surfacemountdevices)——表面贴装器件。SOIC(smallout-lineintegratedcircuit)——双侧引脚小外形封装集成电路QFP(QuadFlatPockage)——四侧引脚扁平封装
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