IC封装(图文对照).pdf

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1、芯片封装方式大全各种ICICIC封装形式图片IC封装形式图片QFPQuadFlatBGAPackageBallGridArrayTQFP100LEBGA680LSBGALBGA160LSC-705LPBGA217LPlasticBallGridArraySDIPSIPSBGA192LSingleInlinePackageSOSmallOutlinePackageTSBGA680LSOJ32LCLCCSOJCNRSOPEIAJCommunicationTYPEII14LandNetworkingRiserSpecificationRevision1.2SOT220SSOP1

2、6LCPGACeramicPinGridArrayDIPDualInlineSSOPPackageTO18DIP-tabDualInlineTO220PackagewithMetalHeatsinkFBGATO247FDIPTO264FTO220TO3FlatPackTO5HSOP28TO52ITO220TO71TO72ITO3pTO78JLCCLCCTO8LDCCTO92LGATO93LQFPTO99PCDIPTSOPThinSmallPGAOutlinePlasticPinGridPackageArrayTSSOPorTSOPIIThinPLCCShrinkOutli

3、ne详细规格PackageuBGAPQFPMicroBallGridArrayPSDIPuBGAMicroBallGridArrayLQFP100L详细规格METALQUAD100LZIP详细规格Zig-ZagInlinePQFP100LPackage详细规格TEPBGA288LTEPBGAQFPC-BendQuadFlatLeadPackageCERQUADSOT220CeramicQuadFlatPack详细规格SOT223CeramicCaseLAMINATESOT223CSP112LChipScalePackage详细规格SOT23GullWingLeadsSOT

4、23/SOT323LLP8La详细规格SOT25/SOT353PCI32bit5VPeripheralSOT26/SOT363ComponentInterconnectSOT343详细规格PCI64bit3.3VSOT523PCMCIASOT89PDIPSOT89PLCC详细规格Socket603FosterSIMM30SingleIn-lineMemoryLAMINATEModuleTCSP20LSIMM72ChipScaleSinglePackageIn-lineMemoryModuleTO252SIMM72SingleIn-lineSLOT1TO263/TO268F

5、orintelPentiumIIPentiumIIISODIMM&CeleronSmallOutlineCPUDualIn-lineMemoryModuleSLOTAForAMDSOCKET370AthlonCPUForintel370pinPGAPentiumIII&CeleronCPUSNAPTKSOCKET423Forintel423pinPGAPentium4SNAPTKCPUSOCKETSNAPZP462/SOCKETAForPGAAMDAthlon&DuronSOHCPUSOCKET7ForintelPentium&MMXPentiumCPU各种封封封封装装装

6、装缩缩缩缩写写写写说说说说明明明明BGABQFP132BGABGABGABGABGACLCCCNRPGADIPDIP-tabBGADIPTOFlatPackHSOP28TOTOJLCCLCCCLCCBGALQFPDIPPGAPLCCPQFPDIPLQFPLQFPPQFPQFPQFPTQFPBGASC-705LDIPSIPSOSOHSOJSOJSOPTOSOPSOPCANTOTOTOTO3CANCANCANCANCANTO8TO92CANCANTSOPTSSOPorTSOPBGABGAZIPPCDIP以下封装形式未找到相关图片，，，仅作简易描述，仅作简易描述，，，供参考，供

7、参考：：：DIM单列直插式，塑料例如：MH88500QUIP蜘蛛脚状四排直插式，塑料例如：NEC7810DBGABGA系列中陶瓷芯片例如：EP20K400FC672-3CBGABGA系列中金属封装芯片例如：EP20K300EBC652-3MODULE方形状金属壳双列直插式例如：LH0084RQFPQFP封装系列中，表面带金属散装体例如：EPF10KRC系列DIMM电路正面或背面镶有LCC封装小芯片，陶瓷，双列直插式例如：X28C010DIP-BATTERY电池与微型芯片内封SRAM芯片，塑料双列直插式例如：达拉斯SRAM系列（