芯片封装大全(图文对照)

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1、芯片封装方式大全各种IC封装形式图片QFPQuadFlatBGAPackageBallGridArrayTQFP100LEBGA680LSBGALBGA160LSC-705LPBGA217LPlasticBallGridArraySDIPSIPSingleInlineSBGA192LPackageSOSmallOutlinePackageTSBGA680LSOJ32LCLCCSOJCNRSOPEIAJCommunicationTYPEII14LandNetworkingRiserSpecificationRevision1.2SOT2

2、20SSOP16LCPGACeramicPinGridArrayDIPDualInlineSSOPPackageTO18DIP-tabDualInlineTO220PackagewithMetalHeatsinkFBGATO247FDIPTO264FTO220TO3FlatPackTO5HSOP28TO52ITO220TO71TO72ITO3pTO78JLCCLCCTO8LDCCTO92LGATO93LQFPTO99PCDIPTSOPThinSmallPGAOutlinePlasticPinGridPackageArrayTSSOPo

3、rTSOPIIThinPLCCShrinkOutline详细规格PackageuBGAPQFPMicroBallGridArrayPSDIPuBGAMicroBallGridArrayLQFP100L详细规格METALQUAD100LZIP详细规格Zig-ZagInlinePQFP100LPackage详细规格TEPBGA288LTEPBGAQFPC-BendQuadFlatLeadPackageCERQUADSOT220CeramicQuadFlatPack详细规格SOT223CeramicCaseLAMINATESOT223CSP

4、112LChipScalePackage详细规格SOT23GullWingLeadsSOT23/SOT323LLP8La详细规格SOT25/SOT353PCI32bit5VPeripheralSOT26/SOT363ComponentInterconnectSOT343详细规格PCI64bit3.3VSOT523PCMCIASOT89PDIPSOT89PLCC详细规格Socket603FosterSIMM30SingleIn-lineMemoryLAMINATEModuleTCSP20LSIMM72ChipScaleSinglePac

5、kageIn-lineMemoryModuleTO252SIMM72SingleIn-lineSLOT1TO263/TO268ForintelPentiumIIPentiumIIISODIMM&CeleronSmallOutlineCPUDualIn-lineMemoryModuleSLOTAForAMDSOCKET370AthlonCPUForintel370pinPGAPentiumIII&CeleronCPUSNAPTKSOCKET423Forintel423pinPGAPentium4SNAPTKCPUSOCKETSNAPZP

6、462/SOCKETAForPGAAMDAthlon&DuronSOHCPUSOCKET7ForintelPentium&MMXPentiumCPU各种封装缩写说明BGABQFP132BGABGABGABGABGACLCCCNRPGADIPDIP-tabBGADIPTOFlatPackHSOP28TOTOJLCCLCCCLCCBGALQFPDIPPGAPLCCPQFPDIPLQFPLQFPPQFPQFPQFPTQFPBGASC-705LDIPSIPSOSOHSOJSOJSOPTOSOPSOPCANTOTOTOTO3CANCANCANC

7、ANCANTO8TO92CANCANTSOPTSSOPorTSOPBGABGAZIPPCDIP以下封装形式未找到相关图片，仅作简易描述，供参考：DIM单列直插式，塑料例如：MH88500QUIP蜘蛛脚状四排直插式，塑料例如：NEC7810DBGABGA系列中陶瓷芯片例如：EP20K400FC672-3CBGABGA系列中金属封装芯片例如：EP20K300EBC652-3MODULE方形状金属壳双列直插式例如：LH0084RQFPQFP封装系列中，表面带金属散装体例如：EPF10KRC系列DIMM电路正面或背面镶有LCC封装小芯片，陶瓷

8、，双列直插式例如：X28C010DIP-BATTERY电池与微型芯片内封SRAM芯片，塑料双列直插式例如：达拉斯SRAM系列（五）按用途分类集成电路按用途可分为电视机用集成电路。音响用集成电路、影碟机用集成电路、录像机用