芯片封装方式大全

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1、芯片封装方式大全  2011-12-0523:58:22

2、  分类： 默认分类

3、举报

4、字号 订阅 各种IC封装形式图片 BGABallGridArrayEBGA680LLBGA160LPBGA217LPlasticBallGridArray QFPQuadFlatPackageTQFP100LSBGASC-705LSDIPSIPSingleInlinePackageSBGA192LTSBGA680LCLCCCNRCommunicationandNetworkingRiserSpecificationRevision1.2 CPGACeramicPinGridArra

5、yDIPDualInlinePackage SOSmallOutlinePackage　  SOJ32LSOJSOPEIAJTYPEII14LSOT220SSOP16LSSOPDIP-tabDualInlinePackagewithMetalHeatsinkFBGAFDIPFTO220FlatPackHSOP28ITO220TO18TO220TO247TO264TO3TO5ITO3pJLCCLCCLDCCLGALQFPPCDIPTO52TO71TO72TO78TO8TO92TO93PGAPlasticPinGridArrayPLCC详细规格PQFPPSDIPLQFP

6、100L详细规格METALQUAD100L详细规格PQFP100L详细规格TO99TSOPThinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayuBGAMicroBallGridArray　 ZIPZig-ZagInlinePackageQFPQuadFlatPackageSOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353TEPBGA288LTEPBGAC-BendLead CERQUADCeramicQuadFl

7、atPack详细规格CeramicCaseLAMINATECSP112LChipScalePackage详细规格GullWingLeads LLP8La详细规格PCI32bit5VPeripheralComponentInterconnect详细规格SOT26/SOT363SOT343SOT523SOT89SOT89Socket603FosterPCI64bit3.3VPCMCIAPDIPPLCC详细规格SIMM30SingleIn-lineMemoryModuleSIMM72SingleIn-lineMemoryModuleSIMM72SingleIn-lineS

8、LOT1ForintelPentiumIIPentiumIII&CeleronCPULAMINATETCSP20LChipScalePackageTO252TO263/TO268SODIMMSmallOutlineDualIn-lineMemoryModuleSOCKET370Forintel370pinPGAPentiumIII&CeleronCPUSLOTAForAMDAthlonCPUSNAPTKSNAPTKSNAPZPSOHSOCKET423Forintel423pinPGAPentium4CPUSOCKET462/SOCKETAForPGAAMDAthlo

9、n&DuronCPUSOCKET7ForintelPentium&MMXPentiumCPU    各种封装缩写说明 BGABQFP132BGABGABGABGABGACLCCCNRPGADIPDIP-tabBGADIPTOFlatPackHSOP28TOTOJLCCLCCCLCCBGALQFPDIPPGAPLCCPQFPDIPLQFPLQFPPQFPQFPQFPTQFPBGASC-705LDIPSIPSOSOHSOJSOJSOPTOSOPSOPCANTOTOTOTO3CANCANCANCANCANTO8TO92CANCANTSOPTSSOPorTSOPBGABGA

10、ZIPPCDIP 以下封装形式未找到相关图片，仅作简易描述，供参考：DIM    单列直插式，塑料        例如：MH88500QUIP    蜘蛛脚状四排直插式，塑料        例如：NEC7810DBGA    BGA系列中陶瓷芯片        例如：EP20K400FC672-3CBGA    BGA系列中金属封装芯片    例如： EP20K300EBC652-3MODULE    方形状金属壳双列直插式例如：LH0084RQFP    QFP封装系列中，表面带金属散装体    例如：EPF10KRC系列DIMM    电路正面或背面镶有LC