最全的芯片封装方式大全

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1、最全的芯片封装方式大全各种IC封装形式图片BGABallGridArrayEBGA680LLBGA160LPBGA217LPlasticBallGridArraySBGA192LTSBGA680LQFPQuadFlatPackageTQFP100LSBGASC-705LSDIPSIPSingleInlinePackageSOSmallOutlinePackage　CLCCCNRCommunicationandNetworkingRiserSpecificationRevision1.2CPGACeramicPinGridArrayDIPD

2、ualInlinePackageDIP-tabDualInlinePackagewithMetalHeatsinkFBGASOJ32LSOJSOPEIAJTYPEII14LSOT220SSOP16LSSOPTO18FDIPFTO220FlatPackHSOP28ITO220ITO3pJLCCTO220TO247TO264TO3TO5TO52TO71LCCLDCCLGALQFPPCDIPPGAPlasticPinGridArrayPLCC详细规格PQFPTO72TO78TO8TO92TO93TO99TSOPThinSmallOutlineP

3、ackagePSDIPLQFP100L详细规格METALQUAD100L详细规格PQFP100L详细规格QFPQuadFlatPackageSOT220SOT223TSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayuBGAMicroBallGridArray　ZIPZig-ZagInlinePackageTEPBGA288LTEPBGAC-BendLead CERQUADCeramicQuadFlatSOT223SOT23SOT23/SOT323SOT25/SOT353S

4、OT26/SOT363SOT343SOT523SOT89SOT89Pack详细规格CeramicCaseLAMINATECSP112LChipScalePackage详细规格GullWingLeads LLP8La详细规格PCI32bit5VPeripheralComponentInterconnect详细规格PCI64bit3.3VSocket603FosterLAMINATETCSP20LChipScalePackageTO252TO263/TO268SODIMMSmallOutlineDualIn-lineMemoryModuleS

5、OCKET370Forintel370pinPGAPentiumIII&CeleronCPUPCMCIAPDIPPLCC详细规格SIMM30SingleIn-lineMemoryModuleSIMM72SingleIn-lineMemoryModuleSIMM72SingleIn-lineSLOT1ForintelPentiumIIPentiumIII&CeleronCPUSOCKET423Forintel423pinPGAPentium4CPUSOCKET462/SOCKETAForPGAAMDAthlon&DuronCPUSOCKET

6、7ForintelPentium&MMXPentiumCPUSLOTAForAMDAthlonCPUSNAPTKSNAPTKSNAPZPSOH各种封装缩写说明BGABQFP132BGABGABGABGABGACLCCCNRPGADIPDIP-tabBGADIPTOFlatPackHSOP28TOTOJLCCLCCCLCCBGALQFPDIPPGAPLCCPQFPDIPLQFPLQFPPQFPQFPQFPTQFPBGASC-705LDIPSIPSOSOHSOJSOJSOPTOSOPSOPCANTOTOTOTO3CANCANCANCANCAN

7、TO8TO92CANCANTSOPTSSOPorTSOPBGABGAZIPPCDIP以下封装形式未找到相关图片，仅作简易描述，供参考：DIM单列直插式，塑料例如：MH88500QUIP蜘蛛脚状四排直插式，塑料例如：NEC7810DBGABGA系列中陶瓷芯片例如：EP20K400FC672-3CBGABGA系列中金属封装芯片例如：EP20K300EBC652-3MODULE方形状金属壳双列直插式例如：LH0084RQFPQFP封装系列中，表面带金属散装体例如：EPF10KRC系列DIMM电路正面或背面镶有LCC封装小芯片，陶瓷，双列直插式例

8、如：X28C010DIP-BATTERY电池与微型芯片内封SRAM芯片，塑料双列直插式例如：达拉斯SRAM系列（五）按用途分类　　集成电路按用途可分为电视机用集成电路。音响用集成电路、影碟机用