资源描述：
《PCB印制电路板以及HDI生产流程详细介绍.英文版.ppt》由会员上传分享，免费在线阅读，更多相关内容在行业资料-天天文库。
1、1PCB以及HDI生产流程详细介绍.2AGENDA1.DetailManufacturing4-65ProcessFlow(Photo)HDIProducts2.TechnologyRoadmapforPCB&HDI66-70TechnologyRoadmapProcessCapabilityDeltonCONFIDENTIALNONDISCLOSUREDeltonCONFIDENTIALNONDISCLOSUREProcessFlow(PCB&HDI)BACK4Pre-engineeringPat
2、ternimagingEtchingLaminatingDrillingCuplatingHolepluggingPatternimagingLaminationLaserAblationMechanicaldrillingPatternimagingCuplatingSolderMaskSurfaceFinishedRoutingVisualinspectionElectrictestShippingProcessFlowChart(1)5Pre-engineeringPatternimaging
3、EtchingLaminatingDrillingProcessFlowChart(2)6DesmearCuplatingHolepluggingCuplatingBeltSandingProcessFlowChart(3)7LaminationLaserAblationMechanicaldrillingCuplatingPatternimagingProcessFlowChart(4)8SolderMaskGoldplatingRoutingElectricaltestPatternimagin
4、gProcessFlowChart(5)9HolecounterShippingVisualinspectionProcessFlowChart(6)10*Rawmaterial(ThinCore,Copper,Prepreg…...)RawMaterial:FR-4(Difuntional,Tetrafuntional)Supplier:Nan-Ya,Grace,EMCSheetsize:36.5”*48.8”,40.5”*48.8”,42.5”*48.8”CoreThickness:0.003”
5、,0.004”,0.005”,0.006”0.008”,0.010”,0.012”,0.015”0.021”,0.031”,0.039”,0.047”CopperFoil:1/3oz,1/2oz,1.0oz,2ozPrepregtype:1080,2112,2116,1506,7628,7630,RCC111.內層基板(THINCORE)LaminateCopperFoil裁板(PanelSize)COPPERFOILEpoxyGlass12PhotoResist2.內層線路製作(壓膜)(DryFi
6、lmResistCoat)EtchPhotoresist(D/F)13PhotoResist3.內層線路製作(曝光)(Expose)A/WArtwork(底片)Artwork(底片)AfterExposeBeforeExpose144.內層線路製作(顯影)(Develop)PhotoResist155.內層線路製作(蝕刻)(Etch)PhotoResist166.內層線路製作(去膜)(StripResist)177.黑氧化(OxideCoating)188.疊板(Lay-up)LAYER2LAYER
7、3LAYER4LAYER5LAYER1LAYER6Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(膠片)Prepreg(膠片)199.壓合(Lamination)20典型之多層板疊板及壓合結構...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板10-12層疊合壓合機之熱板壓合機
8、之熱板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板21墊木板鋁板10.鑽孔(Drilling)2211.電鍍Desmear&CopperDeposition2312.塞孔(HolePlugging)13.去溢膠(BeltSanding)2414.減銅(CopperReduction)→Option15.去溢膠(Belt
