半导体制造技术.pdf

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1、SemiconductorManufacturingTechnology半导体制造技术Instructor’sManualMichaelQuirkJulianSerdaCopyrightPrenticeHallTableofContents目录I.ChapterOverview1.Semiconductorindustryoverview2.Semiconductormaterials3.Devicetechnologies—ICfamilies4.Siliconandwaferpreparation

2、5.Chemicalsintheindustry6.Contaminationcontrol7.Processmetrology8.Processgascontrols9.ICfabricationoverview10.Oxidation11.Deposition12.Metallization13.Photoresist14.Exposure15.Develop16.Etch17.Ionimplant18.Polish19.Test20.AssemblyandpackagingII.Answerst

3、oEnd-of-ChapterReviewQuestionsIII.TestBank(suppliedondiskette)IV.Chapterillustrations,tables,bulletedlistsandmajortopics(suppliedonCD-ROM)NotestoInstructors:1)Thechapteroverviewprovidesaconcisesummaryofthemaintopicsineachchapter.2)Thecorrectanswerforeac

4、htestbankquestionishighlightedinbold.Testbankquestionsarebasedontheend-of-chapterquestions.Ifastudentstudiestheend-of-chapterquestions(whicharelinkedtotheitalicizedwordsineachchapter),thentheywillbesuccessfulonthetestbankquestions.2Chapter1Introductiont

5、otheSemiconductorIndustryDie:管芯defective:有缺陷的DevelopmentofanIndustrySinglecrystalsilicon1.WaferPreparation4.AssemblyandPackaging:includescrystalThewaferiscutScribelinegrowing,rounding,alongscribelinesslicingandpolishing.Wafersslicedfromingottoseparateea

6、chdie.Asingledie2.WaferFabricationMetalconnectionsAssemblyPackagingincludescleaning,aremadeandthelayering,patterning,chipisencapsulated.etchinganddoping.3.Test/SortincludesDefectivedie5.FinalTestensuresICprobing,testingandpasseselectricalandsortingofeac

7、hdieonenvironmentalthewafer.testing.•TherootsoftheelectronicindustryarebasedonthevacuumtubeandearlyuseofsiliconforsignaltransmissionpriortoWorldWarII.Thefirstelectroniccomputer,theENIAC,wasdevelopedattheUniversityofPennsylvaniaduringWorldWarII.•WilliamS

8、hockley,JohnBardeenandWalterBrattaininventedthesolid-statetransistoratBellTelephoneLaboratoriesonDecember16,1947.Thesemiconductorindustrygrewrapidlyinthe1950stocommercializethenewtransistortechnology,withmanyearlypioneersworkingi