SMT流程图.ppt

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1、SMT製程簡介SMTPROCESSINTRODUCES.M.T.SurfaceMountTechnology定義：是指在恰當材質的表面上焊牢為數極多的表面粘裝電子零件(SMDs)的裝配技術.DEFINITION:Atechnologyformountingelectroniccomponents(=SMDs)onthesurfaceofsuitablesubstrate.S.M.D.SurfaceMountDeviceSMD定義:亦稱為SMC,是指能夠藉由表面粘著技術焊接在印刷電路板上之有腳或無腳電

2、子零件.DEFINITION:(orsurfacemountcomponent,SMC),Itisaleadorleadlesselectroniccomponentthatiscapableofbeingattachedtoaprintedboardbysurfacemounting.SMTFLOW領料ReceiveMaterials備料PrepareMaterials錫膏印刷Printingsolderpaste零件置放Pick&PlaceCP7X3QP3X4迴焊Reflow迴焊Reflow零件置放

3、Pick&PlaceCP7X2GSM2X2錫膏印刷Printingsolderpaste轉版ReverseBoardAOIAutoOpticalInspectionAOIAutoOpticalInspection目檢VisualInspection條碼管理系統SFIS入庫ToEnterWarehouse出貨DeliverGoodsAOIAutoOpticalInspection1OKNG下一程序NextProcedure修整TouchUp目檢VisualInspectionOKNG修整TouchUp下一

4、程序NextProcedure目檢VisualInspection2SMTEQUIPMENT-IMPMUP3000-StencilPrinter-印刷机FUJICP643E-High-SpeedMounter-高速置件機(SmallCard)FUJICP742E/742ME-High-SpeedMounter-高速置件機(Mainboard)FUJIQP341E-Multi-Fun.Mounter-泛用置件機UNIVERSALGSM2-Multi-Fun.Mounter-泛用置件機HELLER1900E

5、XLReflow-迴焊爐ORBOTECHVT.8000X-AutoOpticalInspectionForSolderJoint-焊點自動光學檢查機ORBOTECHTrin.2240-AutoOpticalInspectionForPaste-錫膏覆蓋自動光學檢查機EFD1500XL-GlueDispensermachine–點膠機SMTEQUIPMENT-IIHOTPLATE-SolderBallTest-錫球試驗儀MALCOMVISCOMETERPCU-201-ViscosityTest-粘度測試儀

6、HIROX-3DMicroscope-3D顯微鏡Z-CHECK-SolderPasteThicknessMeasurement-錫膏厚度量測儀SMTEQUIPMENT-IIIDATAPAQREFLOWTRACKER-ReflowTemperatureCurveRecord-迴焊爐溫度曲線記錄器FUJIDTIII-2DMeasurement&FeederCalibration-座標機EMC301A-StencilCleaner-鋼板清洗機領料(GETTINGTHEMATERIALS)1.工程目的(ENG.

7、PURPOSE)：領取生產用料Preparetheproductionmaterials.2.作業重點(OPERATIONIMPORTANTS)：2.1實物與領料單規格相符Thematerial’sspecificationmustbethesameasyourBOM.2.2數量正確Quantitymustbecorrect.SolderPaste-ISQ-20-27Non-cleanType-免洗型0%Halogencontent-無鹵化物20-36mparticlesize-錫球直徑20-36m

8、9.0%Fluxcontent(RMA)-助焊劑比重9%SolderPaste-IISQ-20-27IncomingmaterialInspection-進料檢驗SolderballTest-錫球試驗ViscosityTest-粘度試驗Storage-儲存條件0~10℃錫膏印刷-I(PRINTINGSOLDERPASTE)1.工程目的(ENG.PURPOSE)：均勻地印刷錫膏Uniformdepositingsolderpaste.