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1、未来PCB企业的发展方向ThefuturedirectionofPCBenterprisesSoftboard(FPC),namely,FlexiblePrintedCircuitboard(FlexiblePrintedCircuit),relativetothehardboard,softmaterialcharacteristicsofFlexible,andeasytoturn,andtheadvantagesoflightweight,thinthickness,sooftenusedinthedesignofn
2、eedfrivolousormovabletypemechanismdesignofproducts,suchasmobilephones,notebookcomputers,monitors,consumerelectronicproducts,suchastouchpanelandICpackaging.Softboardproductstructurebythesoftcopperfoilsubstrates(FCCL)andflexibleinsulationlayer(PIorPET)iscommonlyused
3、inadhesive(glue)stickattachedbonding,andcanaccordingtocustomerrequestattachedwithastiffeningplateinstalledconnectorsaccessoriessoastoexpandthebusinessscopeorprovidecustomersacompleteservice,therefore,frombuyingcopperfoil,softcopperfoilsubstrate,rawmaterials,suchas
4、PI,totheAssemblyprocess,isthesoftboardindustrygeneralcategory.Therearethreemaindirectionsforthedevelopmentofthesoftboardindustry:Oneisasoftboardwith2LFCCL・Nowstopthestumblingblockisthepriceof21FCCLlarge-scaleapplication,mainlybecausethe21FCCLisinshortsupply,caused
5、byhighgrossmargin,oncepricecompetitionstarts,shipmentswillfurtherexpand,thepricewillberapiddecline.Althoughmanypeoplethinkthatthe3LFCCLwillstillbeinthemainstream,wethinkthemarketwillgomuchfasterthanexpected.Second,itisasoftandhardboard,thankstotheproliferationofsk
6、isandrevolvingphones,andthestrongpushofsouthKoreanmanufacturers,whichhasbecomethetargetofKoreanmanufacturers・Mostsoftboardsinthecountryhavenohardexperience,andthehardboardisachallengetothesemanufacturers・Third,thehighdensitysoftboard,theadventofthe3Gera,thedistrib
7、utiondensityofthephonehasincreasedfurther・Thetraditionaldensityisnotenough・That'swhymostofthe3Gphonesarestraight・WhereshouldthehighlydevelopedPCBindustry,theprintedcircuitboardindustry,go?Industryinsiderspointoutthatitshouldbedevelopedinthedirectionofproductionaut
8、omation,precision,multi-functionandmodernequipment・Inrecentyears,thePCBindustryinChinahasbeendevelopingatahighspeedofover15%annually,andhasenteredtheran
