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1、SEMIE1-0697N/A©SEMI1979,1997SPECIFICATIONFOR3inch,100mm,125mm,AND150mmPLASTICANDMETALWAFERCARRIERS1ScopeedgeperimeterdistanceÑThedistancefromtheedgeofthewafertothetopfaceofthecarrier.(SeeFigure1.1ThisspeciÞcationcoversthedimensionalrequire-1,D7.)mentsforplasticandm
2、etalwafercarriersusedfortheprocessingandhandlingof3inch,100mm,125mm,endwallÑThewallofthecarrieroppositethebarendand150mmdiameterwafers.ThespeciÞcationhasofthecarrier.twoclassiÞcations:GeneralUsageandAutoTransportßangeÑMassofmaterialontheexteriorandperpen-Usage.Gene
3、ralUsageisabasicguidelinethatcoversdiculartothesidewalls.3inch,100mm,125mm,and150mmwafersizes.AutoTransportUsageisintendedtomeetthein-useholeÑTheareaforthepinonanothercarriertoenterrequirementsfortheinterfaceofwafercarrierswithfortransferringwafers.(SeeFigure1,C8.)
4、automatedwaferprocessingequipment.AutoTrans-lotÑ(See"hole.")portUsagecoversthe125mmand150mmsizes.parallelismtoleranceÑTheminimumandmaximum1.2TomeetthesespeciÞcations,carriersmustbedimensionallowancefortheoppositepocketstovarymanufacturedwithinthedimensionallimitsan
5、dbeinrelationtotheirdistancefromthecrossbarendofdimensionallystablewithinthespeciÞcationwhenthecarrier.(SeeFigure1,D1.)usedinaccordancewithmanufacturers'recommenda-tions.pinÑThemassofmaterialwhichenterstheholeorslotofanothercarrierfortransferringwafer.(SeeFig-NOTE:
6、Recommendedusageshouldbeagreedtoure1,C7.)betweenuserandsupplier,sincewafercarriersaremanufacturedfromanumberofdifferentmaterialsbypinandholecenterdistancefrompocketcenterlineÑseveralmanufacturingmethods.Thedistancefromcenterlineofeitherthepinorholetotheclosestpocke
7、tcenterline.(SeeFigure1,C9.)2SelectedDeÞnitionspocketÑTheareainwhichthewaferislocatedintheForapictorialexplanationofmostoftheselecteddeÞ-carrier.nitions,seeFigure1.Figure1symbolsaredeÞnedinpocketcenterlineÑTheimaginarylinewhichbisectsTable1.eachpocket.barÑ(See"cros
8、sbar.")pocketdepthÑThedistancefromthepocketßattoitsbarendÑTheendsurfaceofthecarrierthathasonlyownpocketnose,nottotheoppositepocket.(SeeFig-onecro
