fab中常见缩写介绍

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1、硬件相关：•ESC:ElectricalStaticChuck静电卡盘•TMP:TurboMoleculePump分子泵•DP:DryPump干泵•EPD:EndpointDetection终点检测系统•OES:OpticalEmissionSpectrograph光学发射光谱仪•IEP:InterferometerEndpointDetection干涉测量仪软件相关：•CTC:ClusterToolController群集设备控制器•PMC:ProcessModuleController工艺模块控制器•TMC:TransferModule

2、Controller传送模块控制器工艺相关：•BT:BreakThrough去除自然氧化层•ME:MainEtch主刻•OE:OverEtch过刻•STI:ShallowTrenchIsolation浅沟槽隔离刻蚀•PR:PhotoResist光刻胶•CD:CriticalDimension关键尺寸•AEI:AfterEtchInspection•ADI:AfterDevelopedInspection•ROX:RemainingOxide剩余Oxide层厚度•ER:EtchRate刻蚀速率•EU:EtchUniformity刻蚀均匀性•A

3、EC/APC:AdvancedEquipment/ProcessControl先进设备/工艺控制•PRK:ParticleReduceKits减少颗粒过程•PM:PeriodicMaintenance周期维护芯片加工商相关：•CoO:CostofOwnership•CoC:CostofConsumption•PRS:ProcessReleaseStandard•STR:Splittestingrelease•MSTR:MassSplitTestingRelease•WAT:WaferAcceptanceTest•Fab:Fabricatio

4、n芯片加工厂代称•FA:FabAutomation工厂自动化•CIM:ComputerIntegrationManufacturing计算机集成制造通用术语Table1AcronymsTable表1缩写列表Acronyms/缩写Explanation/解释1WATWaferAcceptanceTest/晶圆测试2RFRadioFrequency/射频3CDCriticalDimension/关键尺寸4CpYieldYield/良率5PRPhotoresist/光刻胶6STIShallowtrenchisolation/沟槽隔离（刻蚀工艺）7

5、MFCMassFlowController/质量流量计8ADIAfterdevelopinspection/显影后检查9AEIAfteretchinspection/刻蚀后检查10CoOCostofOwnership/客户拥有成本11CoCCostofConsumables/消耗成本12MTBFMeanTimeBetweenFailure/平均故障间隔时间13MTTRMeanTimeToRepair/机台平均维修时间14MTBCMeanTimeBetweenClean/平均清洗间隔时间15FECPFieldEquipmentChangePr

6、ocedure/设备合格认证流程16CECustomerEngineer/客户硬件支持工程师17PSEProcessSupportEngineer/客户工艺支持工程师18HCIHotCarrierInject/热载流子注入测试19EFREarlyFailureRate/早期失效率测试20HTOLHotTemperatureOperationLife168/500/1000Hourtest/168/500/1000小时高温运行寿命测试21WPHWaferPerHour/每小时加工的硅片数量TJSMIC术语TableIAcronymsTable

7、表I缩写列表Acronyms/缩写Explanation/解释1PRSProcessReleaseStandard/工艺发布标准2STRSpecialTestRequest/特殊测试要求3MSTRMassSpecialTestRequest/大量特殊测试要求4FECPFieldEquipmentChangeProcedure/设备合格认证流程56HHNEC术语GSMC术语