Comprehensive Optimization Method for Thermal Properties and Parasitics in Power Modules

Comprehensive Optimization Method for Thermal Properties and Parasitics in Power Modules

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时间:2019-08-29

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1、ComprehensiveOptimizationMethodforThermalPropertiesandParasiticsinPowerModulesOleMuhlfeld,FriedrichW.Fuchs¨Christian-Albrechts-UniversityofKiel,GermanyInstituteofPowerElectronicsandElectricalDrivesKaiserstr.2,24143Kiel,GermanyEmail:om@tf.uni-kiel.deAbstract—Acombinedoptimizat

2、ionapproachregardingther-model.Theapproachcanbegeneralizedtoarbitrarylayoutsmalpropertiesandparasiticelementsinsidepowersemiconduc-anddifferentboundaryconditions.Themethodispresentedtormodulesforpowerelectronicconvertersispresented.Thebasedonsimulation.Allsimulationswerecarri

3、edoutbyproposedmethodallowsthedeterminationofthebestsuitedsemi-meansofthesoftwareINCA3d[8]andComsolMultiphysicsconductorpositionsontheDBCsubstrateaswellasoptimizationofthesubstratestructure.Theoptimizationprocedureleadstoa[9],usingPEECandFEMalgorithms,respectively.Asimplematr

4、ixrepresentationillustratingtheresultsinaconcreteway.MOSFEThalf-bridgeconfigurationisusedasanexample,butthestatedmethodscanbeusedforothercircuitsaswell.Keywords—Thermaldesign,EMC/EMI,Packaging,SimulationFollowingthisintroductionasystematicapproachforpowermoduledesignisstated.T

5、hethirdpartintroducesanexemplaryhalf-bridgeoptimizationproblemthatissolvedI.INTRODUCTIONwiththesuggestedapproachinthefourthsection.InthefifthDuetotheongoingincreaseofpowerdensityinpowerparttheoverallperformanceisevaluatedandthepaperismodulesforpowerDCtoACconvertersthecouplingb

6、etweenfinishedwiththeconclusion.thermalpropertiesandparasiticelementsbecomesmoreandmorerelevant.OptimizationoftheDBC(directbondedII.SYSTEMATICOPTIMIZATIONAPPROACHcopper)layoutandthechips’positionsinthesemoduleshelpstoimprovetheelectro-thermalperformanceandtoThesystematicoptimi

7、zationapproachconsistsofthreeenhancereliability.Severalinvestigationshavebeenmadetosteps:first,thebasicboundariesforthelayoutoftheDBCfindoptimallayoutsforthereductionofstrayinductance[1],aredetermined.Thereforetheminimumrequiredsurfacearea[2]ortoincreasethecoolingefficiency[3].a

8、ndcross-sectionofthecopperareasontheDBCareassigned.Forcomprehensiveo

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