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ID:41634771
大小:1.03 MB
页数:6页
时间:2019-08-29
《Comprehensive Optimization Method for Thermal Properties and Parasitics in Power Modules》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
1、ComprehensiveOptimizationMethodforThermalPropertiesandParasiticsinPowerModulesOleMuhlfeld,FriedrichW.Fuchs¨Christian-Albrechts-UniversityofKiel,GermanyInstituteofPowerElectronicsandElectricalDrivesKaiserstr.2,24143Kiel,GermanyEmail:om@tf.uni-kiel.deAbstract—Acombinedoptimizat
2、ionapproachregardingther-model.Theapproachcanbegeneralizedtoarbitrarylayoutsmalpropertiesandparasiticelementsinsidepowersemiconduc-anddifferentboundaryconditions.Themethodispresentedtormodulesforpowerelectronicconvertersispresented.Thebasedonsimulation.Allsimulationswerecarri
3、edoutbyproposedmethodallowsthedeterminationofthebestsuitedsemi-meansofthesoftwareINCA3d[8]andComsolMultiphysicsconductorpositionsontheDBCsubstrateaswellasoptimizationofthesubstratestructure.Theoptimizationprocedureleadstoa[9],usingPEECandFEMalgorithms,respectively.Asimplematr
4、ixrepresentationillustratingtheresultsinaconcreteway.MOSFEThalf-bridgeconfigurationisusedasanexample,butthestatedmethodscanbeusedforothercircuitsaswell.Keywords—Thermaldesign,EMC/EMI,Packaging,SimulationFollowingthisintroductionasystematicapproachforpowermoduledesignisstated.T
5、hethirdpartintroducesanexemplaryhalf-bridgeoptimizationproblemthatissolvedI.INTRODUCTIONwiththesuggestedapproachinthefourthsection.InthefifthDuetotheongoingincreaseofpowerdensityinpowerparttheoverallperformanceisevaluatedandthepaperismodulesforpowerDCtoACconvertersthecouplingb
6、etweenfinishedwiththeconclusion.thermalpropertiesandparasiticelementsbecomesmoreandmorerelevant.OptimizationoftheDBC(directbondedII.SYSTEMATICOPTIMIZATIONAPPROACHcopper)layoutandthechips’positionsinthesemoduleshelpstoimprovetheelectro-thermalperformanceandtoThesystematicoptimi
7、zationapproachconsistsofthreeenhancereliability.Severalinvestigationshavebeenmadetosteps:first,thebasicboundariesforthelayoutoftheDBCfindoptimallayoutsforthereductionofstrayinductance[1],aredetermined.Thereforetheminimumrequiredsurfacearea[2]ortoincreasethecoolingefficiency[3].a
8、ndcross-sectionofthecopperareasontheDBCareassigned.Forcomprehensiveo
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