Nanoscale thermal transport

Nanoscale thermal transport

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时间:2019-08-24

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1、JOURNALOFAPPLIEDPHYSICSVOLUME93,NUMBER215JANUARY2003APPLIEDPHYSICSREVIEWSNanoscalethermaltransporta)DavidG.CahillDepartmentofMaterialScienceandEngineeringandtheFrederickSeitzMaterialsResearchLaboratory,UniversityofIllinois,Urbana,Illinois61801WayneK.

2、FordIntelCorporation,5200NEElamYoungParkway,Hillsboro,Orgeon97124KennethE.GoodsonDepartmentofMechanicalEngineering,StanfordUniversity,PaloAlto,California94305GeraldD.MahanDepartmentofPhysics,PennsylvaniaStateUniversity,UniversityPark,Pennsylvania1680

3、2ArunMajumdarDepartmentofMechanicalEngineering,UniversityofCalifornia,Berkeley,California94720HumphreyJ.MarisDepartmentofPhysics,BrownUniversity,Providence,RhodeIsland02912RobertoMerlinDepartmentofPhysics,UniversityofMichigan,AnnArbor,Michigan48109Si

4、monR.PhillpotMaterialsScienceDivision,ArgonneNationalLaboratory,Argonne,Illinois60439~Received28January2002;accepted1August2002!Rapidprogressinthesynthesisandprocessingofmaterialswithstructureonnanometerlengthscaleshascreatedademandforgreaterscienti®

5、cunderstandingofthermaltransportinnanoscaledevices,individualnanostructures,andnanostructuredmaterials.Thisreviewemphasizesdevelopmentsinexperiment,theory,andcomputationthathaveoccurredinthepasttenyearsandsummarizesthepresentstatusofthe®eld.Interface

6、sbetweenmaterialsbecomeincreasinglyimportantonsmalllengthscales.Thethermalconductanceofmanysolid±solidinterfaceshavebeenstudiedexperimentallybuttherangeofobservedinterfacepropertiesismuchsmallerthanpredictedbysimpletheory.Classicalmoleculardynamicssi

7、mulationsareemergingasapowerfultoolforcalculationsofthermalconductanceandphononscattering,andmayprovideforalivelyinterplayofexperimentandtheoryinthenearterm.Fundamentalissuesremainconcerningthecorrectde®nitionsoftemperatureinnonequilibriumnanoscalesy

8、stems.ModernSimicroelectronicsarenow®rmlyinthenanoscaleregimeÐexperimentshavedemonstratedthatthecloseproximityofinterfacesandtheextremelysmallvolumeofheatdissipationstronglymodi®esthermaltransport,therebyaggravatingproblemsofthermalmanagement.Microel

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