各种封装图解

《各种封装图解》由会员上传分享，免费在线阅读，更多相关内容在工程资料-天天文库。

1、封装形式图解BGABallGridArrayEBGA680LLBGA160LPBGA217LPlasticBallGridArraySBGA192LTSBGA680LCLCCCNRCommunicationandNetworkingRiserSpecificationRevision1.2CPGACeramicPinGridArrayDIPDualInlinePackageDIP-tabDualInlinePackagewithMetalHeatsinkFBGAFDIPFTO-220FlatPackHSOP-28ITO-220ITO-3PJLCCLCCLDC

2、CLGALQFPPCDIPPGAPlasticPinGridArrayPLCCPQFPPSDIPLQFP100LMETALQUAD100LPQFP100LQFPQuadFlatPackageSOT143SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket603FosterLAMINATETCSP20LChipScalePackageTO252TO263/TO268QFPQuadFlatPackageTQFP100LSBGASC-705LS

3、DIPSIPSingleInlinePackageSOSmallOutlinePackageSOJ32LSOJSOPEIAJTYPEII14LSOT220SSOP16LTO247SSOPTO18TO220TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayuBGAMicroBallGridArrayZIPZig-ZagInlinePackageBQFP132

4、C-BendLeadCERQUADCeramicQuadFlatPackCeramicCaseLAMINATECSP112LChipScalePackageGullWingLeadsPDIPPLCCSNAPTKSNAPTK