Alpha 锡膏OM340EN规格书英文版

Alpha 锡膏OM340EN规格书英文版

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时间:2019-08-04

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1、TECHNICALBULLETIN®ALPHAOM-340-NO-CLEAN,LEAD-FREESOLDERPASTE1FINEFEATURE,ZEROHALOGEN,LOWHEADINPILLOWDEFECT,HIGHLYPINTESTABLEDESCRIPTIONALPHAOM-340isalead-free,no-cleansolderpastedesignedforabroadrangeofapplications.ALPHAOM-340providesbestinclasslowdefectrateforHeadinPillowdefe

2、ctscombinedwithexcellentfirstpassyieldonICT/pintesting.ALPHAOM-340alsoyieldsexcellentprintcapabilityperformanceacrossvariousboarddesignsand,particularly,withultrafinefeaturerepeatabilityandhigh“through-put”applications.Outstandingreflowprocesswindowdeliverssuperiorsolderingon

3、CuOSPwithexcellentcoalescenceonabroadrangeofdepositsizes,excellentrandomsolderballresistanceandmid-chipsolderballperformance.ALPHAOM-340isformulatedtodeliverexcellentvisualjointcosmeticsandbestinclassincircuitpintestyields.Additionally,ALPHAOM-340’scapabilityofIPCClassIIIforv

4、oidingandROL0IPCclassificationsensuresmaximumlong-termproductreliability.1ZerohalogenisdefinedasnohalogenisintentionallyaddedtotheformulationFEATURES&BENEFITS•Maximizesreflowyieldforlead-freeprocessing,allowingfullalloycoalescenceatcirculardimensionsassmallas200μm(8mil)with10

5、0μm(4mil)thickstencils•Excellentprintconsistencywithhighprocesscapabilityindexacrossallboarddesigns.•Printspeedsofupto150mm/sec(6”/sec),enablingafastprintcycletimeandahighthroughput.•Widereflowprofilewindowwithgoodsolderabilityonvariousboard/componentfinishes.•Excellentsolder

6、andfluxcosmeticsafterreflowsoldering•BestinclasslowdefectrateforHeadinPillow•Bestinclassincircuitpintestyield•Reductioninrandomsolderballinglevels,minimizingreworkandincreasingfirsttimeyield•MeetshighestIPC7095voidingperformanceclassificationofClassIII•Excellentreliabilitypro

7、perties,halide-freematerial•Compatiblewitheithernitrogenorairreflow•Zerohalogen(Nohalogenintentionallyaddedtotheformulation)PRODUCTINFORMATIONAlloys:SAC305(96.5%Sn/3.0%Ag/0.5%Cu)SAC405(95.5%Sn/4.0%Ag/0.5%Cu)SACX®Plus™0307(99%Sn/0.3%Ag/0.7%Cu)SACX®Plus™0807(98.5%Sn/0.8%Ag/0.7%

8、Cu)InnoLot™(90.95%Sn/3.8%Ag/0.7%Cu/1.4%Sb/0.15%Ni/3%Bi)Forotheralloy

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