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1、IOPPUBLISHINGJOURNALOFMICROMECHANICSANDMICROENGINEERINGJ.Micromech.Microeng.17(2007)24202425doi:10.1088/0960-1317/17/12/005ResearchonoptimizationofthehotembossingprocessYongHe,Jian-ZhongFuandZi-ChenChenDepartmentofMechanicalEngineering,ZhejiangUniver
2、sity,Hangzhou310027,PeoplesRepublicofChinaE-mail:yongqin@zju.edu.cnReceived11June2007,infinalform12August2007Published25October2007Onlineatstacks.iop.org/JMM/17/2420AbstractThehotembossingofpolymerwasstudiedtoimproveproductquality.Thefiniteelementmetho
3、d(FEM)wasusedtoanalyzetheembossingstep,thecoolingstepandthedemoldingstepwithrespecttoproductquality.Thenumericalsimulationresultsshowthatprofileprecisionislargelyinfluencedbythetopologicalstructureofthemoldduringtheembossingstep.Inadequateholdingtimewi
4、llresultinlowpatternfidelity.Inappropriatedemoldingtemperaturecouldinducealargethermalstressatthebottomofthemicropattern,whilekeepingimprintpressureduringthecoolingstepwillaggravatethisphenomenon.Fracture,neckingandpatterndistortioncaneasilybeinducedb
5、yadhesionbetweenthepolymerandthemoldwhenhighaspectratiopatternsaredemolded.Thehotembossingprocesswasoptimizedandanimprovedhotembossingsystemwithanautomaticdemoldingdevicewasdesignedbasedonthesimulationanalysis.Successfulfabricationoffinepatternswithah
6、ighaspectratioverifiedtheimprovements.(Somefiguresinthisarticleareincolouronlyintheelectronicversion)1.Introductionheightdifferences(Linetal2003).Duetothedifferentthermalexpansioncoefficients,alargethermalstressmayappearandThefabricationofmicrostructure
7、swithhotembossingisaninducefractureofthepolymermicrostructureduringtheimportanttechnologyduetoitsnumerousadvantagessuchascoolingstep.Asforthedemoldingstep,theadhesionbetweenlowcost,highefficiencyandparalleloperation(Quakeandthepolymerandmoldwhichisagg
8、ravatedbythermalstressScherer2000,HeckeleandSchomburg2004).Ontheotherinducedduringcoolingmayleadtofinalpatterndefects.Tohand,typicalproblemsstillremain,suchaslowpatternfidelity,overcometheadhesionproblem,twomethodsofreleaseagentslonghotembossingtimeand
