Dynamic Electro-thermal Simulation of Microsystems

Dynamic Electro-thermal Simulation of Microsystems

ID:40058725

大小:1.31 MB

页数:23页

时间:2019-07-18

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1、2DynamicElectro-thermalSimulationofMicrosystemsThermalmanagementhasbecomeacrucialissueindesigningmodernmicroelec-tronicandmicroelectromechanicalcomponentsandsystems.Onlyafteracarefulstudyofthermaleffectsinmicrosystemscanwepredicttheirperformance,reliabil-ityandyield.Inintegratedc

2、ircuits,thermalmanagementisimportantonalllevels,startingfromthetransistorlevel,overthechiplevel,thepackagelevelandtheprintedcircuitboard(PCB)level,tothesystemlevel.Theself-heatingoftransistorsmayleadtooscillationphenomena[14]affectingthewholecircuitbehavior.Highcurrentdur-ingelec

3、trostaticdischargemayincreasethelocaltemperaturetoomuchanddestroythetransistor.Self-heatingofaninterconnectmayreduceitsaveragetimetofailure.Itisimportanttopositionelementsonachipinsuchawaythattheeffectofheatingisminimalwithrespecttothechip’sfunctioning[15].Efficientheattransferis

4、ofparamountimportanceforpackaging[16,17]asthereliabilitydependsheavilyonthermalmanagement[18–21].Finally,theplacementofsemiconductordevicesonaPCBshouldalsobeoptimalfromthethermalmanagementviewpoint.Itisworthyofnotethatthereliabilityofthewholeboardistiedtoitstemperatureregimebecau

5、setherearemanymechanismsthatleadtoenhancedboarddegradationatele-vatedtemperatures.Thesameissuesconcernmicrosystems[22]althoughtherequirementsheremaybedifferent.Ifforconventionalintegratedcircuitsthegoalistokeeptemperatureclosetoroomtemperature,inmicrosystemsoneneedstokeepsomepart

6、satrela-tivelyhightemperatures;usuallyseveralhundreddegrees.ExamplescanbefoundinnumerousMEMSdevices,suchasthermalactuators[23],thermalflowsensors[24],microhotplategassensors[25,26],tunableopticalfilters[27–29]andmanyothers.Theheatingchangesopticalpropertiesinopticalfilters,reduce

7、sactivationenergiestoallowmetaloxidestodetectgasesandcausesmechanicalstressandthusmovementinactuators.Theheattransferthroughmovingfluidallowsustomeasuretheflowrateinheat-flowsensors.Thediverseengineeringproblemsmentionedabovehaveincommonthatanengineershouldbeabletopredictthetempe

8、raturedistributionforthegiven82DynamicEl

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