pcb design guide

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1、DG-001Rev.1.04PrefaceThePCBDesignGuidelinesareintendedtoprovideafoundationforconveyingDesignforManufacturinginformationtoallofthosethatmayinfluencethedesignoftheproduct.Theguidelinesarenotmeanttoreplacetheconcurrentengineeringinteractionthatisessentialf

2、oroptimumdesignresultsandproductlifecyclecosts.Designtrade-offanalysesperformedinconjunctionwiththedesignguidelinesmustalsoconsiderthemanufacturingstrategiesandbusinessdirectionofproducingallproducts.Thisdocumentwillcontinuetochangeascapabilities,techno

3、logy,andprocessesimproveandasproductandmanufacturingstrategiesevolve.Yourinvolvementandfeedbackisfundamentalforthecontinuousimprovementofthisdocument.IfyouhaveanyquestionsorsuggestionsregardingthePCBDesignGuidelinesstructure,itscontent,oritsdistribution

4、,pleasecontactoneofthefollowingWatertownrepresentativesoryourspecificmanufacturingengineeringcontactforassistance.Theywillhelpyouordirectyoutotheappropriateindividual.DocumentOwnerDarylFeryancePhone:920-262-6127Adnet450-6127email:feryade@ch.etn.comWhat’

5、snewwithrevision1.04•Section3hasbeenupdatedwithelectronicrequirementsforUnicamCAMsoftware.•Section2.3paneldrawingwithICTtoolingholekeepoutdimension.Break-awaydrawingclarifiedwithadditionaldimensions.What’snewwithrevision1.03•Section2.3Panelizationhasbeu

6、pdatedwithadditionalpanelsizes.Alsodimensionsandnoteshaveaddedtothepaneldrawingforclarity.•Section2.1.3StandardSMTParts,wavesolderlandpatternswerecorrectedfrompreviouserrorsforbothchipresistorsandchipcapacitors(pages12&14).PleaseupdateyourCADlibraryacco

7、rdingly.•PleasenotethatIPClandpatternsareforreferenceuseonly,anddonotrepresentthemostrecentprocesscapabilityoftheindustry.What’snewwithrevision1.02•Section2.3Panelizationpage46hasbeenchanged.Weaddedseveralmorepanelsizestochoosefrom.Alsothedimensioningre

8、ferenceisnowtherighthandedgeofthepanel.What’snewwithrevision1.01•Thestencilopeningaperturerequirementhasbeendeleted.Allstencilartworkshouldbesizeonsize.•Anerrorwascorrectedinsection2.2.1.7forradialcomponentsmaximumheightisnow0.84