PCB板专业知识

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1、PCB板专业词汇BbBackplane背板Back-up垫板Baking烘板BallGridArray(BGA)球栅阵列Bareboard裸板BaseCopper底铜Basematerial基材Bevelling斜边BlackOxide黑氧化Blindviahole盲孔Blistering起泡/水泡BoardCutting开料BoardThickness板厚Bottomside底层Breakawaytab打断点Brushing磨刷Build-up积层Bulletpad子弹盘Buriedhole埋孔CcC/M(Compo

2、nentMarking)元件字符Carbonink碳油Carrier带板Ceramicsubstrate陶瓷CertificateofCompliance合格证书Chamfer倒角Chemicalcleaning化学清洗Chemicalcorrosion化学腐蚀ChipScalePackage(CSP)晶片比例包装Circuit线路Clearance间距/间隙Color颜色ComponentSide(C/S)元件面Compositelayers复合层ComputerAidedDesign(CAD)电脑辅助设计Compu

3、terAidedManufacturing(CAM)电脑辅助制作ComputerNumerialControl(CNC)数控Conductor导体Conductorwidth/space导体线宽/线隙Contact接点Copperarea铜面积Copperclad铜箔Copperfoil铜箔Copperplating电镀铜Corner角线Cornermark板角记号CornerREG.Hole角位对位孔Cracking裂缝Creasing皱折Criteria规格,标准Crossectionarea切面Cu/SnPlat

4、ing镀铜锡Currentefficiency电流效率Customer客户CustomerDrillingFile客户钻孔资料CustomerP/N客户产品编号DdD/FRegistrationHole干菲林对位孔D/F(DryFilm)干膜DateCode日期代号Datumhole基准参考孔Daughterboard子板Deburring去毛刺Defect缺陷Definition定义Delamination分层Delay耽搁Delivery交货Densitometer透光度计Density密度Department部门

5、Description说明Designorigin设计原点Desmear去钻污,除胶Dessicant防潮珠Developer显影液,显影机Diamond钻石Diazofilm重氮片Dielectricbreakdown介电击穿Dielectricconstant介电常数DielectricThickness介电层厚度DielectricVoltageTest绝缘测试Dimension尺寸Dimensionalstability尺寸稳定性Direct/indirect直接/间接Distribution发放Documen

6、ttype文件种类DocumentationControl文件控制Doublesidedboard双面板Drillbit钻咀Drilling钻孔DrillingRoughness钻孔粗糙度DryFilm干菲林DryFilm-Pattern干膜线路Dynamic动态EeECN(EngineeringChangeNotification)工程更改通知Effectivedate有效期ElectricalTestFixture电测试针床Electromigration漏电Electroconductivepaste导电胶Ele

7、ctroless无电沉Electrolesscopper无电沉铜ElectrolessNi无电沉镍ElectrolessGold/Au无电沉金Engineeringdrawing工程图纸Entek有机涂覆Epoxyglasssubstrate环氧玻璃基板Epoxyresin环氧基树脂Etch蚀刻Etchback凹蚀Etching蚀刻E-TestMarking电测试标记E-Test(ElectricalTest)电测试Exposure曝光Externallayer外层FfFiducialmark基准点Filling填充F

8、ilmFabrication菲林制作FinalQC最终检查FinishOverallBoardThickness成品总板厚度Fixture夹具Flammability可燃性FlashGold薄金Flexible易曲的,能变形的Flux助焊剂GgGeneralinformation一般资料Ghostimage重影Glasstrans