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1、CupricChloride-HydrochloricAcidMicroetchRougheningProcessanditsApplicationsKeshengFeng,NileshKapadia,BrianJobson,SteveCastaldiElectronicsSolutions,MacDermid,Inc.227FreightStreet,Waterbury,CT06702AbstractMultiPrepisacupricchloride-hydrochloricacidbasedmicroetchantprocessdeveloped
2、byMacDermid,Inc.basedinWaterbury,CT.Thisprocessprovidesauniqueroughenedcoppersurface,whichyieldsexcellentadhesionforbothsoldermaskanddryfilmphotoresistapplications.Theprocessalsoyieldsexcellentsoldermaskadhesionthroughsubsequentsilver,tinandnickelplatingpostsoldermaskapplication
3、.Theamountofcopperetchedusingcupricchloride-hydrochloricacidbasedmicroetchantisnotashighasthatseentypicallyincupricchlorideetchingsystems.Airborneoxygenisefficientenoughtobeusedasanoxidizerinthesystem.Hydrochloricacidmaintainstheproperhydrogenandchlorideionconcentrations.Thecupr
4、icionmaintainsitselfthroughouttheprocess.Thechemistryandprocessarebotheasilycontrolled.Theprocessoperationiscomparabletoaminicupricchlorideetcher,wherebycopperconcentrationismaintainedbyspecificgravityandaciditycanbecontrolledbyconductivity.Itisnotnecessarytocontroloxidation-red
5、uctionpotential,hencethedifferenceascomparedtoconventionaletchingprocesses.ThistechnologyprovideshighlyroughenedcoppersurfacesforconventionalacidplatedcoppersuchasPPRandDC,andstandardregularcopperclad,whichoffersgreatadhesionforsoldermaskanddryfilmphotoresist.Forsoldermaskapplic
6、ations,itisnecessarytoproducearoughertopographybycontrollingmicroetchingrateat1.0-1.5µm/mtogetgoodadhesionbetweencoppersurfaceandsoldermaskwhenthefinalfinishisinvolvedinimmersionorelectrolessplatingprocesswithtinornickel.Fordryfilmphotoresistapplications,theprocessedcoppersurfac
7、eisroughenoughtoimprovetheadhesionatmicroetchingratebelow1.0µm/m.Thecoppersurfaceroughnessshouldbecontrolledwithinarangetobalancetheadhesionandresolutionwhendryfilmphotoresistisusedforfinelineboards.1IntroductionAtElectronicCircuitsWorldConvention11Conference,Shanghai,China,Marc
8、h17-19,2008,anewmicroetchingchemistry,cupricchl
