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1、MIDsolutionMar2011AgendaTelechips:MainplatformSiano:CMMB&ISDB-TInpaq:RFAntena&CircuitprotectcomponentLiteon:lightsensor&proximitysensorEpson:CrystalRichTech:DC-DC&LDO&Reset&USBswitchBosch:G-SensorWinbond:DDR2&SPIAnpec:DC-DC&LDOInfinoen:TVS&RPDFortemedia:Echocancellation&NoiseSuppressionSummit:Bat
2、teryChargingiPAD精艳问世?iPad使用行为调查2011~2015年平板计算机出货预估Tablet成为电信运营商增加ARPU的新利器RichMedia内容商是第二波点火的助攻者,商用市场导入仍以iPAD为首选,尤以金融领衔Source:拓墣产业研究所,2011/02Unit:MuTelechipsTCC8803MIDTelechipsTCC8803powerfulprocessor1G-1.2GHzCoretexA8256KBunifiedL2cacheHardwiredVPUenables1080PfullHDvideoencodinganddecodingHardwir
3、edGPUoffersupto20Mpolygon3DgraphicwithOpenGLES2.0andOpenVG1.1HardwiredISPprovidesAWB,AEcontrol,Autofocus,LensShadeCorrectorUpto400MHzDDR3/DDR2/LPDDR2/LPDDRSDRAM,support16/32bitdatabusTelechipsTCC8803fullformatvideoMovingPictureDecoder(1080p)-H.264/H.263,VC-1(WMV9),Divx,RV/RMVB,MPEG-1/2/4,AVSMovin
4、gPictureEncoder(1080P)-H.264/H.263,MPEG4VideoOut-RGB,HDMI,CPUtypeLCDoutputVideoIn-16MpixelParallelCameraInterface,ImageSignalProcessingTelechipsTCC8803SophisticatedAudioAudioCodec:MP2,MP3,MIDI,OGG,AAC,WAV,WMA,FLAC,APE,BASC,AC3,DTSContainer:3GP,ASF,MP4,AVI,MKV,MPG,M2TS,TS/TP,FLVTelechipsTCC8803MID
5、MainFunctionsAndriod2.2/2.3WiFi:Atheros6102/63023G:-Huawei3Gmodule:EM660C,EM660,EM770/EM770W,MU509-Huawei3Gdongle:--EVDO:EC122,EC169C,--WCDMA:E1750,E1752,K3765-ZTEMF210-MobilePeak:3GmoduleanddongleK80DTV:CMMB,ISDB-T,DVB-TATV:RDAGPS:SIRFA3,UBLOGBluetooth:CSR(BC04/06/07),RDATelechipsMIDPCBAphotoMID
6、PlatformSamsungSP5V210CortexA8(3rdpartyRMVB,noSata/LVDS/EthernetMAC)FreescaleiMX535CortexA8(noRMVB,noHDMI)NvidaTegra2CortexA9(noSATA,over$20)RockchipRK2918CoretexA8(noSATA/CVBS)QualcomQSD8250CoretexA8TIOmap36xxCoretexA8(noSATA/CVBS)MarvellAmarda610CoretexA8(noSATA/CVBS)VIAWM8650ARM11(720P,)Telech
7、ipsMIDRoadmapBasedonthematureTCC8902ARM11/Android2.1MIDsolution,TelechipsspeedupTCC8803CoretexA8/Android2.2tohigh-endforeignMIDmarket.TelechipswillreleaseAndroid2.3MIDSDKbytheendofFeb.TelechipswillreleaseTCC8920Coretex