HDI板设计过程

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1、HDIHDI=HighDensityInterconnectKennethJonssonBoAnderssonNCABGroupTopics•Definitions/Standards(IPC)•Pros&Cons•Keyequipment•Build-ups•Choiceofmaterial•Designrules•IPC–HDI–reliability•(µviastacked/filled)•(Copperpillartechnology)Definitions/StandardsforHDI•

2、IPC-2221AGenericStandardonPrintedBoardDesign(5/03)•IPC-2222SectionalDesignStandardforRigidOrganicPrintedBoards(2/98)FinaldraftA•IPC-7095BDesignandAssemblyProcessImplementationforBGAs(03/08)•IPC-6011GenericPerformanceSpecificationforPrintedBoards(7/96)•I

3、PC-6012BQualificationandPerformanceSpecificationforRigidPrintedBoards(03/08)FinaldraftC•IPC-4101CSpecificationforBaseMaterialsforRigidandMultilayerBoards(07/09)Definitions/StandardsforHDI•IPC-DD-135QualificationTestingforDepositedOrganicInterlayerDielec

4、tricMaterialsforMultichipModules(8/95)•IPC-2226SectionalDesignStandardforHighDensityInterconnect(HDI)Boards(04/03)•IPC/JPCA-2315DesignGuideforHighDensityInterconnects(HDI)andMicrovia(06/00)•IPC-6016Qualification&PerformanceSpecificationforHighDensityInt

5、erconnect(HDI)LayersorBoards(05/99)•IPC-4104SpecificationforHighDensityInterconnect(HDI)andMicroviaMaterials(5/99)Definitions/StandardsforHDIHDIgeneraldescriptionPrintedcircuitboardwithahigherwiringdensityperunitareathanconventionalprintedcircuitboards(

6、PCB).Theyhavefinerlinesandspaces(≤100µm),smallervias(<150µm)andcapturepads(<400µm),andhigherconnectionpaddensity(>20pads/cm2)thanemployedinconventionalPCBtechnology.IPC-2226definitionofmicroviaAblindholewithadiameter(≤150µm)havingapaddiameter(≤350µm)for

7、medbyeitherlaserormechanicallydrilling.IPC-T-50H:HighDensityInterconnect(HDI)Agenerictermforsubstratesorboardswithahighercircuitdensityperunitareathanconventionalprintedboards.IPC-2226definesHDIin6classesTypeI1(C)0or1(C)1•Definesasinglemicrovialayeronei

8、theroneorbothsidesofcore.•Corecanbemultilayer,rigidorflex.•CoreistypicallymanufacturedusingconventionalPWBtechniques.•Usesbothplatedmicroviasandplatedthroughholesforinterconnection.•Employsblind,butnotburiedvias.IPC-2226definesHD