Semiconductor and IC Package Thermal Metrics.pdf

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1、ApplicationReportSPRA953B–July2012SemiconductorandICPackageThermalMetricsDarvinEdwards................................................................................................................................ABSTRACTManythermalmetricsexistforsemiconductorandintegratedcircuit(IC)packagesranging

2、fromθjatoΨjt.Often,thesethermalmetricsaremisappliedbythosewhotrytousethemtoestimatejunctiontemperaturesintheirsystems.Thisdocumentdescribestraditionalandnewthermalmetricsandputstheirapplicationinperspectivewithrespecttosystem-leveljunctiontemperatureestimation.Contents1Theta-ja(θja)Junction-to-Ambie

3、ntandTheta-jma(θjma)Junction-to-MovingAir....................................22Theta-jc(θjc)Junction-to-Case............................................................................................53Psi-jt(Ψjt)Junction-to-TopofPackage...............................................................

4、....................84Theta-jb(θjb)Junction-To-Board..........................................................................................95Psi-jb(Ψjb):Junction-to-Board...........................................................................................116IndustrialandCommercialTemperatur

5、eRanges.....................................................................127MiscellaneousDefinitions................................................................................................128References........................................................................................

6、.........................12ListofFigures11svs.2s2pPCBforVariousPackages..................................................................................32DieSizeImpactonaCSP.................................................................................................43J/Avs.PintoPadDistance.....

7、...........................................................................................44CuColdPlateMeasurementProcess..............................................................................