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页数:13页
时间:2019-03-20
《Semiconductor and IC Package Thermal Metrics.pdf》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
1、ApplicationReportSPRA953B–July2012SemiconductorandICPackageThermalMetricsDarvinEdwards................................................................................................................................ABSTRACTManythermalmetricsexistforsemiconductorandintegratedcircuit(IC)packagesranging
2、fromθjatoΨjt.Often,thesethermalmetricsaremisappliedbythosewhotrytousethemtoestimatejunctiontemperaturesintheirsystems.Thisdocumentdescribestraditionalandnewthermalmetricsandputstheirapplicationinperspectivewithrespecttosystem-leveljunctiontemperatureestimation.Contents1Theta-ja(θja)Junction-to-Ambie
3、ntandTheta-jma(θjma)Junction-to-MovingAir....................................22Theta-jc(θjc)Junction-to-Case............................................................................................53Psi-jt(Ψjt)Junction-to-TopofPackage...............................................................
4、....................84Theta-jb(θjb)Junction-To-Board..........................................................................................95Psi-jb(Ψjb):Junction-to-Board...........................................................................................116IndustrialandCommercialTemperatur
5、eRanges.....................................................................127MiscellaneousDefinitions................................................................................................128References........................................................................................
6、.........................12ListofFigures11svs.2s2pPCBforVariousPackages..................................................................................32DieSizeImpactonaCSP.................................................................................................43J/Avs.PintoPadDistance.....
7、...........................................................................................44CuColdPlateMeasurementProcess..............................................................................
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