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1、GrowthandshearstrengthofintermetalliccompoundsinSn-Ag-CusolderjointsJiandongZhu,ChunqingWang*,ChunjinHang,YanhongTianStateKeyLaboratoryofAdvancedWeldingandJoining,HarbinInstituteofTechnology,Harbin150001,ChinaE-mailaddress:wangcq@hit.edu.cn,Tel:+8645186418725Inthisarticle
2、,twoofthetypicalSn-Ag-CusolderalloysAbstractandAu-Ni/Cusubstratewereselected.ThemorphologyofThegrowthevolutionofintermetalliccompoundsandinterfacialIMClayersandsheartestsofthesolderjointsshearpropertiesofvariousSn-Ag-Cusolderjointswerewereexamined.Theeffectsofthermalcycli
3、ngtesttotheinvestigatedbythermalcyclingtest.ThenumbersofthermalgrowthofIMClayerswereinvestigated.cyclingtestswere0,200,400,600,800cycles.Polyhedronparticlescompositedof(Cu1-xNix)6Sn5wereobservedafterExperimentalprocedure400thermalcyclesandfoundinbulksolderawayfromtheTwoki
4、ndsofSn-Ag-Cusolderballs,Sn-1.0wt.%Ag-IMClayersaftermuchmorethermalcycles.Meanwhile,0.5wt.%CuandSn-3.0wt.%Ag-0.5wt.%CuweresuppliedcracksareobservedintheinterfacialIMClayersafterbySenjuMetal.Meanwhile,thediametersofthetwotypicalthermalcyclingexperiment.Theshearstrengthofso
5、ldersolderballswere350μmand450μm,respectively.ThejointsdecreasedwithincreasingthecyclesofthermalENIG(Au-Ni/Cu)padswereemployed.Theproportioncyclingtest.betweenthediameterofasolderballandthecorrespondingIntroductionpadonFR-4boardwas1.2.ThesolderballswerebondedtoSolderjoint
6、splayagreatroleinelectronicspackaging,padwithRMAfluxinareflowprocesswithamaximumservingaselectricalinterconnections,mechanicalsupporttemperatureof245℃for30s.andheatdissipationbetweenthecomponentsandtheboardAfterreflow,someofthesamplesweredividedinto[1-2].Withelectronicpack
7、agesincreasinginsubstratesize,differentgroupsforthermalcyclingtestof200,400,600,havinggreaterinterconnectdensityandbecomingmore800cyclesfrom-65to150℃accordingtoJESD22-A104-B,complexingeometryandmaterialproperties,thereliabilityrespectively.ofsolderjointswillbecomemoreandm
8、orecriticaltotheTheshearstrengthwastestedinDage4000.Thelong-termperformanceofelectronicproducts[
