Chip on Board Development for a Novel MEMS Accelerometer for Seismic Imaging .pdf

Chip on Board Development for a Novel MEMS Accelerometer for Seismic Imaging .pdf

ID:34932193

大小:1.58 MB

页数:6页

时间:2019-03-14

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1、ChiponBoardDevelopmentforaNovelMEMSAccelerometerforSeismicImagingZhuqingZhang,JenniferWu,SheldonBernardTechnologyDevelopmentOrganization,IPG,HewlettPackardCompany1000NECircleBlvd,Corvallis,OR97330,USARobertG.WalmsleyHewlett-PackardLaboratories,Hewlett-PackardCompany1501PageMillRd,

2、PaloAlto,CA94304,USAzhuqing.zhang@hp.comlownoisefloor,lowpowerconsumption,smallsize,andAbstractrobustnesstomeettheneedofseismicimaging[2].HPisdevelopingaMEMSaccelerometerthatoffershighThisMEMSsensorusesbothSibulkmicromachiningandsensitivityandlownoiselevelforseismicapplication.Dur

3、ingstandardthinfilmtechnologies,andismadebybondingtwothepackagingprocess,itwasfoundthatthethermalseparatesiliconwafersonwhichelectrodesresidefacingeachmechanicalstressresultedfromtheCTEmismatchbetweenotheracrossasmallgap.Ononeside,rotorelectrodesarethesiliconandthesubstratecandist

4、orttheMEMSstructurearrayedonamovingstructurereferredtoastheproofmassorandalterthedeviceperformance.Afiniteelementmodelwasrotor.Theproofmassconnectstothedieframethroughasetestablishedtounderstandtheeffectofsubstratematerial,diesiliconflexuresdefinedbyaBoschdeepsiliconetch.Facingatt

5、achmaterialandpackagegeometryonthescalefactorandthemovingrotorelectrodesacrossasmallgaparethestatorbiasoffsetoftheMEMS.Themodelpredictedthatceramicorfixedelectrodes.Thegapbetweentherotorandthestatorsubstrateintroducedlessvariationofthesensorperformanceelectrodesisdefinedbywaferbon

6、ding[3].Thescalefactorofovertheoperatingtemperaturerange(-40to70°C)thanthetheaccelerometer(dC/da)isgivenbyFR4substrate.InordertousethelowcostFR4substrate,onecanusedieattachadhesivewithlowmodulusand/orsmalldie(1)attachareatominimizethegapanddisplacement.CeramicpackagesandChiponBoar

7、d(COB)packagesonFR4wheredC/daisdefinedasthecapacitivechangeperunitofsubstratewerebuiltusingvariousdieattachadhesivestoacceleration,dC/dxisthechangeincapacitanceasafunctionvalidatethemodel.TheperformanceoftheMEMSwasofdisplacement,anddx/daisthechangeinpositionwithmeasuredfrom-40to70

8、°C.Resultsshowedthatusingalowacce

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