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1、Chapter12MaterialsandTechnologyforConductiveMicrostructuresJanFelba(*ü)andHelmutSchaefer12.1ConductiveNanosizedParticlesforMicroelectronicsPackagingoftodaysminiaturizedelectronicsisbasedonconductivemicrostructuresandcontactswithdimensionsintherangeoftensofmicrometers.Suchlines,patterns,orarr
2、aysofdotsarepossibleundertheconditionthatbothspecialtech-nologiesandmaterialsareapplied.Sincethelateeightiesofthelastcentury,digitalinjectiontechnologyhasbeenwidelyexploredbytheelectronicindustryindevel-opingnewmanufacturingprocesses.Thetechnologyisfavoredmainlyduetothehigherprocessingprecis
3、ionascomparedwithtraditionalprocesses.Ink-jettech-nologyneedsaspecialliquid,usuallytermedink,whichshouldsatisfyatleastthefollowingthreerequirements:verylowviscosity,canbetreatedasatruesolventwithoutcomponentseparationduringhighacceleration,andisabletomakeelec-tricallyconductivestructures.Ifa
4、suspensionisusedasthefluidforprinting,theconductivityconditionrequiresapplyingelectricallyconductiveparticles,andthetruesolventdemandsparticleswithdimensionsassmallaspossible,nothigherthantensofnanometers.Inkforprintingconductivemicrostructuresistypicallybasedonnoblemetalsofnanosizeddimensio
5、nsbecauseoftheirchemicalinertnessinambientatmosphereandgoodelectricalconductivitymainlyAg,althoughnano-Auisalsoinuse.Therearemanymethodsofproducingnano-Agparticles.Themethodscanbebrieflydescribedasmetaldissipationinplasmaprocess,chemicalreactionprocess,electrochemicalprocess,thermaldecomposi
6、tionprocess,vaporcondensationprocess,andothers.Thefinalproductmustbeprotectedfromagglomeration.Becauseofthis,onlymethodsthatyieldsingularnanoparticlesseparatedfromotherscanbeusedforproductionofnanosizedparticlesasfillerforprintedformulations.Amongmethodsmentionedearlieranddescribedintheliter
7、ature,onlyafewareworthtakingintoconsideration,becausetheyactuallyareappliedinnanometalsmanufacturing/production.Oneofthemisthegasevaporationprocess.ThisprocessJ.FelbaFacultyofMicrosystemElectronicsandPhotonics,WroclawUniversityofTechnology,WroclawP
