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1、Source:ElectronicMaterialsandProcessesHandbookChapter5SolderTechnologiesforElectronicPackagingandAssemblyJennieS.HwangH–TechnologiesGroup,Inc.Cleveland,Ohio5.1Introduction5.1.1ScopeWhatdrivestheend-usemarketarethecontinuedconvergenceofcomputing,communication,an
2、dentertainmentaswellastherelentlessgrowthofthewireless,portable,handhelddigitalelectronicsandoptoelectronics.Ontheever-changingtechnologylandscape,theindustryhasrespondedandwillcon-tinuetorespondtocompetitivedemandsintheglobalmarketplace.Newelec-tronicgadgetswi
3、llbefeaturedwithincreasinglyhigherfunctionality,furthersimplicity,lowercost,andgreateroperationalease.Whathastranspiredfromthesemarketdemandsiscontinuedtechnologicalinnovationandanever-shorteningproductlifecycle.Environment-friendlymanufacturingandthedeliveryof
4、environmentallybenignend-useproductsthatareultimatelysafeattheendoftheproductlifecyclewillbecomeessentialtotechnology-busi-nesscompetitiveness.Thisisacontinuingchallengetotheindustry.Solderhasservedastheinterconnectingmaterialforallthreelevelsofconnections:die,
5、package,andboardassembly.Inaddition,tin/leadsolderiscommonlyusedasasurfacecoatingforcomponentleadsandPCBsurfacefinishes.Inad-ditiontosoldermaterials,theprocessusedtoformsolderjointstoaccomplishthevitalfunctionofelectrical,thermal,andmechanicallinkagesbetweentwom
6、etallicsurfacesisequallyimportant.5.1DownloadedfromDigitalEngineeringLibrary@McGraw-Hill(www.digitalengineeringlibrary.com)Copyright©2004TheMcGraw-HillCompanies.Allrightsreserved.AnyuseissubjecttotheTermsofUseasgivenatthewebsite.SolderTechnologiesforElectronicP
7、ackagingandAssembly5.2Chapter5Thischapteraddressessoldertechnologiesinbothmaterialandprocessas-pectsforelectronicpackagingandassembly.Consideringtheestablishedroleoflead(Pb)andthedemandinPb-freematerials,soldercanbeclassifiedasei-therlead-containingorlead-free.I
8、nlightoftheglobalenvironmentalcommit-ment,thischapterwillalsocoverPb-freematerialsintermsoftheirpropertiesandcharacteristicsthatareimportanttotheirapplicationsinelec-tronicp
