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ID:33965511
大小:8.44 MB
页数:53页
时间:2019-03-02
《合金元素对sn-9zn钎料钎焊6061铝合金的影响》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
1、内蒙古工业大学硕士学位论文AbstractSolderasanancientwayofweldingiswidelyused.WiththetoxicityofPbandnationalbanPblegislativeactionswereimplemented,traditionalSn-Pballoyssolderislimited.Sn-Znlead-freesolderhasthepotentialtobereplacetraditionalsolderbecauseofitslowmeltingpointandcost,advancedmechanicalprop
2、ertiesandSn-Znbasedlead-freesolderbecauseofthelowmeltingpointandcost,goodmechanicalpropertiesisexpectedtoreplacethetraditionalsolder.However,poorperformancesinoxidationresistanceandwettabilityresistancelimiteditsapplications.InordertoamelioratethedisadvantagesofSn-Znlead-freesolder.Byaddin
3、gelementsofCuandREmethodwasadoptedtotheSn-9Znalloy,andinvestigateofexistingformandevolutionmechanism.Theresultsindicatethattheexistofcopperimprovethethesoldermicrostructureandcopperaredispersedinthematrix.Theformofthesecondphaseconsistofcopperandzincmakeitharderforzincphasetogrowupandbeoxi
4、ded.XRDresultsindicatethatCuZn,Cu6Sn5andCu5Zn8existsinthesolder,butaddingmassfractionofCuwithresultingcompoundisnotproportionalrelationship,whichslowlyincreasewhileitaddgreaterthan0.7%.AdditionofCudoesnotexistasthesinglephase,buttheformationoflowmeltingcompound.Intheanalysisofweldedjoint,i
5、tisfoundthatzincenrichmentphaseinsolderandsphericalaluminumsolidsolutionindissolvingdiffusionzoneshowsatrendofgrowingupafterthefirstdecreasesandcoppercontentof0.2%isacut-offpoint.Whenweldingjointhaveagoodcondition,solderof0.3%copperhaveabestperformancethattheshearstrengthincreasedby1.5time
6、s.Fracturepresentaductilefracture,andthesourceoffractureiszincenrichmentphase.Itisthusconcludedthatcopperzincsolidsolutionformingthesecondphaseimprovethestrengthofsolder.TheadditionofLa-CeelementsthatutilizesolutionagingmethodsinSn-9Znalloysoldercanimprovethesoldermicro-structure,zincenric
7、hmentphasewasrefinedandtheclusterspeedofcopperenrichmentphasewasreduced.AllthesemakeitharderforCu6Sn5toform.InfactthattheadditionofREhavelittleeffectonzincenrichmentphase,butmakeadifferenceinreducingthediffusionofaluminumtosolderandincreasingthediffusionofsold
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