sn-cu焊料薄膜的制备与其电沉积行为的分析

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1、摘要阶跃电位的负移，Sn-Cu合金沉积初期的电结晶行为经历了向瞬时形核机制的转变。Sn-Cu合金；电沉积；可焊性；电化学Ⅱ中南大学硕士学位论文AbstractLead．freesolderplatingisacurrentresearchhot．andiSalSOthedevelopmenttrendofelectronicsindustry．Inthispaper,throughlargenumbersofexperimentandtheapparentstateanalysisdeterminedtheacidbathc

2、ompositionofSn．Cualloyplatingandtheoptimalprocessconditionswerescreenedout．TheeffectofbatheompostionsandprocessfactorsonthemicrostructureandmorphologyofalloySn-CualloycoatingswerestudiedbySEM(attachedEDS)，theeffectof也eseprocessfactorsonthecoatingsolderabilityalSOwa

3、sstudied，andsystematicallytestthebestalloycoatingcomposition,meltingpoint，hardness，adhesionstrengthandcorrosionresistance．Besides，theinitialstageoftheelectrodepositionofSn-Cu．andthee髓ctofadditivewereinvestigatedbypolarizationcurve，cyclicvoltammetryandchronoamperome

4、try,particularlystudieddeeplyontheinitialbehaviorofelectrodeposition．MainconclusionasfoUows：1、TheacidsulfatebathsolutionsincludingSnS04，CuS04，specialcomplexingagent．surfactantandantioxidant．nleprocessofelectroplatingalloyWasoptimizedbyusingsingle—factorexperiment，t

5、heoptimalprocessCOnditionswerescreenedoutasfollows：SnS04：40Ig／L，CuS04：0．89／L，Citricacid：40}egL，H2S04：1009／L，Thiourea：0．08egL，Glutin：2eeL，Beta-nophthol：0．89／L，Hydroquinone：19／L，bathtemperament：25℃，currentdensity：3A／dm‘，depositiontime：20min．TheSn．Cualloycoatingsareo妇

6、阿hite，andthesurfaceofcomingsarebright,smoothanddense．coppercontentiSabout0．5％～2％．andcathodecurrentemciencyisabout70％．2、TheeffectofbathcompositionandplatingprocessonthecoatingsurfacemorphologyandthemicrostmctureWasinvestigatedbvSEMandEDS．Theresultsshowed，withplating

7、conditionschanging，thecoatingsshowdifferentmicrostructureandmorphologycontainingmassivegrain，blukgrainandbandingandSOon，andtheimpactofthioureaandcitricacidiSgreater．Inthepresenceofcitricacidandthiourea,thefilmsurfacebecamesmooth,compact．uniformandthebathstability．T

8、hepresenceofthioureareducedclearlythecoppercontentinplmingandthecoppercontentremafnedstable．3、ThesolderabilityofSn．Cualloycoatingobtainedfromacid