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1、Chapter19Propertiesof63Sn-37PbandSn-3.8Ag-0.7CuSoldersReinforcedWithSingle-WallCarbonNanotubesK.MohanKumar(*ü),V.Kripesh,andAndrewA.O.Tay19.1IntroductionAsintegratedcircuit(IC)technologycontinuestoadvance,therewillbeincreasingdemandsonI/Ocountsandpowerrequirements,le
2、adingtodecreasingsolderpitchandincreasingcurrentdensityforsolderballsinhigh-densitywafer-levelpackages[1].Astheelectronicsindustrycontinuestopushforminiaturization,reliabilitybecomesavitalissue.Thedemandformoreandsmallersolderbumps,whileincreasingthecurrent,hasalsore
3、sultedinasignificantincreaseincurrentdensity[2],whichcancausethefailureofsolderinterconnectsduetoelectromigration[3].SoldersareextensivelyusedinICtechnologyasmechanicalandelectricalinter-connectsbecauseoftheireaseofprocessingandlowercost.However,becauseoftheirrelativ
4、elylowmeltingtemperatures,creepisamajorconcern.Whenelec-tronicdevicesareswitchedonandoff,theelectronicpackagesexperiencecyclicchangesintemperature.Becauseofdifferencesbetweenthepackagesandthesub-strate,cyclicchangesinthermomechanicalstressesareinducedinthepackage-to-
5、boardsolderjoints.Suchcyclicstressesinthesolderjointseventuallyleadtofailureofthesolderjointsthroughthermomechanicalfatigue[4,5].WiththerelentlesstrendtowardveryfinepitchICpackages,thecyclicstressesexperiencedbyflipchip-to-boardinterconnectsareincreasinggreatly,resul
6、tinginadrasticdropinfatiguelifeofsolderjoints.Onewayofovercomingthisproblemistousenewmaterials,whichcanprovideenhancedmechanical,electrical,andthermalproperties.Compositesolderscanofferimprovedproperties[6].Althoughafewresearchershaveinvestigatedtheinfluenceofnanopar
7、ticlesandnanotubesonthepropertiesofsolder[79],theseinvestigatorsweremainlyfocusedonthemechanicalpropertiesofthesolders.Inthisstudy,theinfluenceofnanotubeaddi-tiononmicrostructural,mechanical,electrical,wetting,andthermalpropertieshasbeeninvestigated.Inadditiontothis,
8、effortshavebeenmadetoevaluatethejointstrengthandcreepstrengthofthecompositesolderjoints.K.M.KumarNano/MicrosystemsIntegrationLabora
