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1、AbstractBecauseofthesizeandweightofelectronicdevicesarestrictlylimitedinthefieldofaviationandaerospace,StackAssemblytechnologyneedstobedevelopedtoadapttotherequirementsofminiaturization,multifunction,aswellasalargestoragespace.Butwiththeincreasementofpowerconsumptionandhe
2、at,thechip’sreliabilitywillbeaffected.Soanefficientandaccuratethermalanalysismethodofthestackassemblyisrequired.Althoughtheresearchofstackassemblytechnology,whichistreatedasanimperativetechnology,hasmadecertainachievementsathomeandabroad,butinthefieldofthermalanalysis,ana
3、lyticalmethodsneedtobefurtherexploredandimproved.Thefiniteelementmethodandthefinitedifferencemethodareusuallyusedintheanalysisofthechip.However,thefiniteelementmethodneedsalongtime,andthefinitedifferencemethodconvergesslowly.Whilethethermalbalancemethodofmicroelementunits
4、issimpleandconvergesfaster.Sothethermalbalancemethodofmicroelementunitsisusedforthestudyofthermalanalysis.Inthispaper,athermalbalancemethodofmicroelementunitstothermalanalysisandnumericalsolutionisproposed,whichisbasedonamathematicalmodelofstackassemblyinthree-dimensional
5、steady-statetemperaturefield.Detailedstudyofstackassemblytechnologyandprocessismade,soistheanalysisofthenecessityandthemaindifficulties.Amodelinthree-dimensionalsteady-statetemperaturefieldisestablishedaccordingtothephysicalmodelofthestackassemblytodeterminetheboundarycon
6、ditionsandclassifytheboundarynodesreasonably.Thethermalbalancemethodofmicroelementunitsisusedtogetthenumericalsolutionoftheequationsofinternalnodes(includingboundarynodes).Usingknownparameters,theheatbalanceequationsforeachnodearederivedsimplification,andthevaluesoftheste
7、ady-statetemperatureofeachnodeareobtainedintheMATLABenvironment.Theexperimentaldatashowsthatthemathematicalmodelofstackassemblyinthree-dimensionalsteady-statetemperaturefieldisreasonable.Usingthethermalbalancemethodofmicroelementunitstonumericallysolveissimpleandcorrect.T
8、hemethodaccuratelyreflectsthethermaldistributionofthestackassembly.Inthefurtherwork,thethermalan
