三维高密度集成电路中锥形硅通孔电特性分析

《三维高密度集成电路中锥形硅通孔电特性分析》由会员上传分享，免费在线阅读，更多相关内容在行业资料-天天文库。

1、上海交通大学硕士学位论文Second,analyticalRLGCmodelisappliedindriver-TSV-LoadcircuittorepresentthesignalresponseofpulsesignalandtrapeziumsignalwithinverseLaplaceTransform.ResultsshowgoodagreementwithHSPICEsimulation.ResultsalsoshowthatignoringtheRLGCmodelwillleadstoanerrorupto6.

2、2%indelayand12.1%inrisingtime.KEYWORDS:Three-DimensionalIntegratedCircuits(3D-ICs),TaperedThroughSiliconVia(TSV),CharacteristicsExtracting,EquivalentCircuit,PartialElementEquivalentCircuit(PEEC)IV万方数据上海交通大学硕士学位论文目录第一章绪论...............................................

3、..................................................................................11.1研究背景..................................................................................................................................11.2研究现状......................................

4、............................................................................................31.2.1硅通孔及其工艺技术...................................................................................................31.2.2硅通孔的等效模型研究............................................

5、...................................................61.3本文主要工作..........................................................................................................................8第二章硅通孔电路参数提取理论基础..................................................................

6、...........................102.1引言........................................................................................................................................102.2硅通孔对电路参数提取理论...............................................................................

7、.................122.2.1硅通孔的电流连续性.................................................................................................122.2.2硅通孔的MOS结构...................................................................................................152.2.3硅通孔对的传输线模型与S参数

8、.............................................................................192.3部分等效元电路法(PEEC)..........................................