用于柔性显示屏的驱动芯片连接技术

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1、上海交通大学硕士学位论文3.5.1COF/TCP封装·······································································393.5.2COG封装·············································································403.5.3ACFbonding组装技术·····························································413.6柔性显示动芯片组装方案提出·············

2、··········································463.6.1Wirebonding方案··································································473.6.2覆晶方案描述·······································································483.6.3ACFbonding方案描述·····························································493.7

3、各方案可行性分析······································································503.7.1Wirebonding可行性分析·························································503.7.2覆晶方案可行性分析······························································513.7.3ACFbonding方案可行性分析·······································

4、············523.8方案筛选··················································································533.9本章小结··················································································54第四章柔性基材组装方案验证······························································554.1试验准备···················

5、·······························································554.1.1实验材料选择········································································554.1.2实验设备简介········································································584.1.3ACAbonding组装制程简析···········································

6、···········594.2柔性显示驱动芯片连接试验方案····················································634.2.1可行性测试···········································································634.2.2重复性及可靠性测试·······························································644.2.3压合区域域电阻值测试··································

7、··························664.2.4ACAbonding模拟实现柔性显示功能··········································664.3柔性显示驱动芯片组装试验结果及讨论···········································694.3.1可行性测试试验结果讨论····························