smtpcba品质检验标准

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1、完美WORD格式.整理SMTPCBA品质检验标准文件编号：版本：制修订单位：制修订日期：制定者：审查：核准：.专业资料分享.完美WORD格式.整理NO版本修订页次发行日期修订内容修改人批准人1A2013.5.15目录1范围.................................................................4.专业资料分享.完美WORD格式.整理2规范性引用文件.......................................................43术语和定义......

2、....................................................43.1冷焊点..........................................................44回流炉后的胶点检查...................................................45焊点外形.............................................................5.1片式元件——只有底部有焊端..........

3、.............................5-65.2片式元件——矩形或正方形焊端元件——焊端有1、3或5个端面.........7-115.3圆柱形元件焊端..................................................12-155.4无引线芯片载体——城堡形焊端....................................15-175.5扁带“L”形和鸥翼形引脚.........................................18-225.6圆形或扁平形（精

4、压）引脚........................................22-245.7“J”形引脚.....................................................24-285.8对接/“I”形引脚................................................28-305.9平翼引线........................................................315.10仅底面有焊端的高体元件...........

5、..............................31-325.11内弯L型带式引脚................................................32-345.12面阵列/球栅阵列器件焊点.........................................34-375.13通孔回流焊焊点.................................................37-386元件焊端位置变化....................................

6、.................38-397焊点缺陷.............................................................7.1立碑............................................................407.2不共面...........................................................407.3焊膏未熔化..........................................

7、.............417.4不润湿（不上锡）(nonwetting).......................................417.5半润湿（弱润湿/缩锡）(dewetting)....................................417.6焊点受扰.........................................................427.7裂纹和裂缝........................................................

8、427.8针孔/气孔........................................................437.9桥接（连锡）...................