smtpcba品质检验标准

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1、WORD文档下载可编辑SMTPCBA品质检验标准文件编号：版本：制修订单位：制修订日期：制定者：审查：核准：专业资料整理分享WORD文档下载可编辑NO版本修订页次发行日期修订内容修改人批准人1A2013.5.15目录1范围.................................................................4专业资料整理分享WORD文档下载可编辑2规范性引用文件.......................................................43术语和定义...

2、.......................................................43.1冷焊点..........................................................44回流炉后的胶点检查...................................................45焊点外形.............................................................5.1片式元件——只有底部有焊端....

3、...................................5-65.2片式元件——矩形或正方形焊端元件——焊端有1、3或5个端面.........7-115.3圆柱形元件焊端..................................................12-155.4无引线芯片载体——城堡形焊端....................................15-175.5扁带“L”形和鸥翼形引脚.........................................18-225.

4、6圆形或扁平形（精压）引脚........................................22-245.7“J”形引脚.....................................................24-285.8对接/“I”形引脚................................................28-305.9平翼引线........................................................315.10仅底面有焊端的高体元

5、件.........................................31-325.11内弯L型带式引脚................................................32-345.12面阵列/球栅阵列器件焊点.........................................34-375.13通孔回流焊焊点.................................................37-386元件焊端位置变化.....................

6、................................38-397焊点缺陷.............................................................7.1立碑............................................................407.2不共面...........................................................407.3焊膏未熔化........................

7、...............................417.4不润湿（不上锡）(nonwetting).......................................417.5半润湿（弱润湿/缩锡）(dewetting)....................................417.6焊点受扰.........................................................427.7裂纹和裂缝...................................

8、.....................427.8针孔/气孔........................................................437.9桥接（连锡）...................