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ID:20606409
大小:5.09 MB
页数:62页
时间:2018-10-14
《软脆晶体lbo的固结磨料抛光研究》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
1、南京航空航天大学硕士学位论文roughnessSadeclineswithpolishingpressure,rotatingspeedandrotatingspeedratioincreasing,anditdecreasesfirstlyandthenriseswithincreasingslurryflowrate.AftercomprehensiveoptimizationofsurfacequalityandMRR,theprocessparametersthatarepolishingpressure14kPa,rotatingspeed70r/mi
2、n,rotatingspeedratio0.95andslurryflowrate60ml/min.TheMRRoftheoptimalprocessparametersis93nm/minandthesurfaceroughnessSais0.184nm,withoutobviousdamage.(4)TheeffectofinstallationmannerandprocessparametersonflatnessofLBOcrystalwasinvestigated.Theflatnessisimprovedbyadoptingtheloaderwhic
3、hcanprovideuniformloading.Theoptimalprocessparametersofflatnessarepolishingpressure14kPa,slurryflowrate80ml/min,rotatingspeedratio(50/50)r/minandswing68~68mm.ThePVvalueof20pointsafterpolishingwiththeoptimalprocessparametersis0.6251wv.Andfinally,theconclusionsofthispaperweresummarized
4、andthefurtherworkoffixedabrasivepolishingofLBOcrystalwasprospected.Keywords:LBOcrystal;Fixedabrasivepolishing;Abrasive-freeslurry;Fixedabrasivepad;Processparameters;SurfaceroughnessIII软脆晶体LBO的固结磨料抛光研究目录第一章绪论.............................................................................
5、........................................................11.1引言....................................................................................................................................11.2LBO晶体简介...............................................................................
6、.....................................21.3固结磨料抛光技术............................................................................................................21.3.1固结磨料抛光技术概述.........................................................................................21.3.2固结磨料抛光技术的研究现状...
7、..........................................................................41.3.3热固型亲水性固结磨料研磨抛光垫.....................................................................51.4软脆晶体的加工现状........................................................................................................71.
8、5本文研究的主要内容..
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